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Wafer Scale N‐Doped Diamond (111) with Mainly Nitrogen Spin Bath Limited Nitrogen Vacancy Coherence Times from Heteroepitexial Growth

MetadataDetails
Publication Date2025-10-08
Journalphysica status solidi (RRL) - Rapid Research Letters
AuthorsJürgen Weippert, Jan Engels, Jan Kustermann, T. Fehrenbach, C. Wild
InstitutionsFraunhofer Institute for Applied Solid State Physics, Diamond Materials (Germany)
AnalysisFull AI Review Included

Wafer Scale N-Doped Diamond (111) for Quantum Applications: 6CCVD Technical Analysis

Section titled “Wafer Scale N-Doped Diamond (111) for Quantum Applications: 6CCVD Technical Analysis”

This document analyzes the recent research on wafer-scale heteroepitaxial N-doped diamond (111) growth for Nitrogen Vacancy (NV) quantum applications. It highlights the critical material specifications achieved and outlines how 6CCVD’s advanced MPCVD capabilities can meet and exceed the requirements for scalable quantum device fabrication.


This research successfully demonstrates the feasibility of producing high-quality NV-doped diamond on a wafer scale, achieving performance metrics essential for quantum sensing and computing.

  • Wafer-Scale Heteroepitaxy: Successful growth of N-doped diamond on 2” (50 mm) Ir/YSZ/Si (111) substrates using MPCVD and Epitaxial Lateral Overgrowth (ELO).
  • Record Coherence Time: Achieved a T₂ coherence time of 9.3 µs, the highest value ever reported for heteroepitaxial diamond (111).
  • High T₂/T₂ Ratio:* Demonstrated an exceptional T₂/T₂* ratio of almost 100 (T₂* = 95 ns), indicating that the coherence time is primarily limited by the nitrogen spin bath (P1 centers).
  • Preferential Orientation: Observed a strong preferential orientation of NV centers (ca. 90%) along the surface normal, crucial for addressing NVs in quantum devices.
  • Layer Structure: The functional material consists of a 50 µm N-Cap layer superimposed on a 23 µm intrinsic diamond layer.
  • Material Challenge: The primary limitation identified is heavy strain and fragility in the heteroepitaxial material, which negatively impacts sample stability and T₂* performance.

The following hard data points were extracted from the research, defining the performance and structural characteristics of the N-doped diamond material.

ParameterValueUnitContext
Wafer Diameter50mmSubstrate size (2” Ir/YSZ/Si)
T₂ Coherence Time (Hahn-Echo)9.3µsHighest reported for heteroepitaxial (111)
T₂* Dephasing Time (Ramsey)95nsInhomogeneous dephasing time
T₂/T₂* RatioAlmost 100-Indicates spin bath limited coherence
N-Cap Layer Thickness50µmNitrogen-doped functional layer
Intrinsic Layer Thickness23µmGrown via ELO stabilization
Total Nitrogen Concentration (P1)7.3ppmMeasured by ToF-SIMS in N-Cap
NV Incorporation Efficiency0.1%Ratio of NV centers to total N concentration
Preferential NV OrientationCa. 90%Along the surface normal
Diamond (111) Rocking Curve FWHM2.3°Overall crystal quality
N-Cap Growth Frequency915MHzUsed 915 MHz ellipsoid reactor
N-Cap Growth Temperature920KCVD process temperature
N-Cap Growth Time118hTotal growth duration for N-Cap

The heteroepitaxial diamond stack was fabricated using a multi-step MPCVD process involving specialized reactors and techniques to manage strain and promote (111) growth.

  1. Template Preparation: Ir/YSZ/Si (111) wafers (50.8 mm diameter) were grown using Magnetron Sputtering Epitaxy (MSE).
    • Iridium (Ir) Deposition: DC, 70 W power, 975 K temperature, 0.01 Pa pressure.
    • Yttria-Stabilized Zirconia (YSZ) Deposition: RF, 250 W power, 1050 K temperature, 0.31 Pa pressure (O₂/Ar ratio 1:2).
  2. Bias-Enhanced Nucleation (BEN): Diamond was nucleated in a 2.45 GHz ellipsoid reactor with a 370 V bias applied to a ring electrode.
    • Recipe: 2.5 kW power, 940 K temperature, 3.5 kPa pressure, CH₄/H₂ ratio 3.2%.
  3. Epitaxial Lateral Overgrowth (ELO) Structuring: A pixel pattern (5 µm radius, 10 µm pitch) was applied to the nucleated sample to facilitate lateral growth and coalescence.
  4. Intrinsic Bulk Growth: A 23 µm intrinsic layer was grown in a 2.45 GHz ellipsoid reactor.
    • Recipe: 3.8 kW power, 920 K temperature, 6.3 kPa pressure, CH₄/H₂ ratio 1.7%.
  5. N-Cap Deposition (NV Layer): A 50 µm nitrogen-doped layer was grown in a 915 MHz ellipsoid reactor, optimized for high N incorporation and low twinning.
    • Recipe: 11.7 kW power, 920 K temperature, 12 kPa pressure, CH₄/H₂ ratio 0.5%, N₂/H₂ ratio 0.5%.
    • Strain Mitigation: Active Si dumping (using randomly oriented diamond pieces) was employed to prevent Si incorporation and subsequent Silicon Vacancy (SiV) center formation.

The research successfully validated the potential of wafer-scale (111) diamond for quantum applications, but identified significant challenges related to material strain and NV incorporation efficiency. 6CCVD offers specialized MPCVD diamond solutions that directly address these limitations, enabling researchers to move from proof-of-concept to robust, scalable devices.

To replicate the high T₂ performance while mitigating the reported strain and fragility issues, 6CCVD recommends the following materials:

Material GradeApplication Focus6CCVD Advantage
Optical Grade SCD (111)Highest T₂ performance, low strain, fundamental research.Provides the lowest defect density and highest crystalline quality (Ra < 1 nm polished), eliminating the high strain and mosaic tilt observed in heteroepitaxy. Ideal for achieving the theoretical T₂ limit (28 µs).
High-Purity PCD (111)Wafer-scale HVM, cost-sensitive applications.Available in large formats (up to 125 mm diameter) with controlled (111) orientation, offering a scalable alternative to the 2” heteroepitaxial approach.
Custom N-Doped SCD/PCDOptimized NV density and depth profiling.We offer precise control over nitrogen flow and growth parameters to maximize NV incorporation efficiency (targeting > 0.25%) and achieve 100% preferential orientation.

6CCVD’s in-house engineering and fabrication services are designed to meet the precise, complex requirements of quantum device integration:

  • Wafer Scale & Dimensions: While the paper demonstrated 50 mm (2”) heteroepitaxy, 6CCVD provides Polycrystalline Diamond (PCD) plates up to 125 mm in diameter, enabling true high-volume manufacturing scale-up.
  • Precision Thickness: We offer SCD and PCD layers with thickness control from 0.1 µm up to 500 µm, allowing researchers to precisely tailor the 50 µm N-Cap layer depth or create complex multi-layer structures.
  • Advanced Polishing: We guarantee ultra-smooth surfaces, critical for subsequent lithography and device integration. Our polishing achieves Ra < 1 nm for SCD and Ra < 5 nm for inch-size PCD.
  • Custom Metalization: For integrating NV centers into functional quantum devices (e.g., microwave delivery structures, electrodes), 6CCVD offers internal metalization capabilities, including Au, Pt, Pd, Ti, W, and Cu deposition.

The primary challenge identified in this research—heavy strain leading to sample fragility and T₂* degradation—is inherent to heteroepitaxial growth. 6CCVD’s in-house PhD team specializes in mitigating these issues through optimized homoepitaxial growth recipes.

  • Strain Mitigation: Our experts can assist with material selection for similar NV Quantum Sensing projects, recommending low-strain SCD (111) substrates to achieve superior T₂* and T₂ performance, surpassing the limits imposed by the heteroepitaxial template.
  • Recipe Optimization: We provide consultation on achieving maximum NV orientation purity and optimizing the N-doping profile to push the T₂ coherence time closer to the theoretical P1 limit of 28 µs.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Diamond (111) is grown heteroepitaxially on 2″ Ir/YSZ/Si (111) wafers (YSZ=yttria‐stabilized zirconia) with a diameter of 50 mm and off‐cuts of up to 6, applying plasma‐enhanced chemical vapor deposition supported by bias‐enhanced nucleation and epitaxial lateral overgrowth. In the final growth step, a nitrogen‐doped layer (N‐Cap) is superimposed. In the N‐Cap, a preferential orientation of nitrogen vacancy (NV) centers along the surface normal is observed, which has a T coherence time of 9.3 μs, which is the highest value ever reported for heteroepitaxial diamond (111). In the meantime, the T dephasing time is 95 ns, which means that the T / T ratio is almost 100, while published ratios for homoepitaxial diamond are in the range 5-20. The total nitrogen concentration as measured by Time‐of‐Flight Secondary Ion Mass Spectrometry is determined to be 7.3 ppm, which, in combination with photoluminescence analysis, yields an NV incorporation efficiency of .