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Record performance in intrinsic, impurity-free lateral diamond photoconductive semiconductor switches

MetadataDetails
Publication Date2025-04-01
JournalApplied Physics Letters
AuthorsZhuoran Han, J. Lee, Anik Mazumder, Hubert N. Elly, Stephen Messing
InstitutionsUniversity of Illinois Urbana-Champaign
AnalysisFull AI Review Included

Technical Documentation and Analysis: Ultra-Pure Diamond for High-Power Photoconductive Switches

Section titled “Technical Documentation and Analysis: Ultra-Pure Diamond for High-Power Photoconductive Switches”

This document analyzes the requirements and achievements detailed in the research paper on intrinsic lateral diamond photoconductive semiconductor switches (PCSS). It highlights how 6CCVD’s advanced MPCVD capabilities directly support the replication and extension of this high-performance research.


The research successfully demonstrates record-breaking performance in diamond PCSS by utilizing ultra-low impurity, intrinsic Type IIa substrates. This material choice is critical for achieving high-power, high-speed switching capabilities that surpass traditional wide bandgap (WBG) semiconductors.

  • Record Performance: Achieved a peak photocurrent of 8.0 A and an unprecedented on/off ratio of 2.3x1011 at 1.2 kV DC bias.
  • Material Purity is Key: Performance is directly correlated with impurity concentration; the best device (PCSS A) used CVD IIa diamond with boron [B] < 1.0x1014 cm-3 and nitrogen [N] < 3.0x1015 cm-3.
  • High-Speed Operation: Demonstrated fast switching transients with a rise time of 2.2 ns and a fall time of 6.5 ns, suitable for high-frequency applications.
  • Intrinsic Triggering: Superior results were achieved using above-bandgap UV excitation (218 nm), maximizing photoelectric conversion efficiency by avoiding sub-bandgap impurity states.
  • High-Power Potential: The linear current-voltage (I-V) relationship up to 1.2 kV suggests the current can be further scaled at higher operating voltages.
  • Market Advantage: Diamond PCSS is positioned as a competitive, superior alternative to SiC and GaN solutions for high-power, high-speed switching.

The following table summarizes the critical performance metrics and material properties achieved by the best-performing device (PCSS A).

ParameterValueUnitContext
Substrate TypeCVD IIaN/ALowest impurity concentration
Boron Impurity [B]< 1.0x1014cm-3Below SIMS detection limit
Nitrogen Impurity [N]< 3.0x1015cm-3Below SIMS detection limit
Peak Photocurrent8.0AAt +1.2 kV DC bias, 65 µJ pulse
On/Off Ratio (ROFF/RON)2.3x1011N/ARecord high for diamond PCSS
Minimum On-Resistance (RON)115.07ΩAt +1.2 kV DC bias
Normalized Responsivity9.1x10-8A-cm/W-VHighest reported for intrinsic triggering
Rise Time (10%-90%)2.2nsHigh-speed switching performance
Fall Time (90%-10%)6.5nsLimited by intrinsic carrier lifetime
DC Bias Voltage Range±1.2kVTested range for high-power assessment
Trigger Wavelength218nmAbove-bandgap UV excitation
Laser Pulse Energy65µJMaximum energy used for high-current test
Surface Roughness (RMS)0.4 to 1.2nmComparable across all substrates
Diamond Bandgap5.47eVUltra-wide bandgap (UWBG)

The PCSS devices were fabricated using precise diamond processing techniques, emphasizing surface preparation and high-quality metal contacts.

  1. Substrate Selection: Use of double-side polished Type IIa diamond substrates (4.5 mm x 4.5 mm x 0.5 mm) with varying, but precisely characterized, impurity levels measured via Secondary Ion Mass Spectrometry (SIMS).
  2. Surface Cleaning: Substrates underwent an RCA cleaning process to eliminate organic and metallic contaminants prior to metalization.
  3. Surface Termination (Initial): Oxygen termination achieved by treating samples in a boiling H2SO4:HNO3 mixture for 2 hours.
  4. Electrode Deposition: Lateral rectangular electrodes were deposited via electron-beam evaporation.
    • Metal Stack: Ti (30 nm) / Pt (30 nm) / Au (120 nm).
    • Geometry: 2.1 mm spacing, 3.9 mm length, 0.9 mm width.
  5. Contact Annealing: Samples were annealed at 450 °C under an Argon (Ar) ambient for 1 hour to optimize contact resistance.
  6. Surface Termination (Stabilization): Post-annealing, devices were treated with ozone at room temperature for 1 hour to stabilize the oxygen-terminated surface.
  7. Optical Triggering Setup: A tunable Optical Parametric Oscillator (OPO) laser provided UV pulses (212 nm - 240 nm) with a 4 ns FWHM and 10 Hz repetition rate.
  8. Electrical Circuit: Transient switching was evaluated using a 95 nF capacitor (Cs) charged via a 1 MΩ resistor (Rs), discharging through the PCSS and a 47 Ω load resistor (RL).

6CCVD is uniquely positioned to supply the high-purity MPCVD diamond materials and custom fabrication services required to replicate and advance this record-setting PCSS research. The core finding—that performance scales directly with material purity—is a direct validation of 6CCVD’s specialization in electronic and optical grade Single Crystal Diamond (SCD).

Applicable Materials for High-Performance PCSS

Section titled “Applicable Materials for High-Performance PCSS”

To achieve the record-setting performance of PCSS A, researchers require diamond with impurity levels below the detection limits of standard SIMS analysis. 6CCVD guarantees the necessary material quality:

  • Optical Grade Single Crystal Diamond (SCD): This material is the direct equivalent of the ultra-low impurity CVD IIa substrate used in PCSS A. We offer SCD with guaranteed low background concentrations of Boron and Nitrogen, essential for maximizing carrier mobility (µ) and lifetime (τ), thereby ensuring superior photoconductive efficiency (α ∝ µητ).
  • Electronic Grade SCD: For applications requiring slightly thicker or larger wafers, our Electronic Grade SCD maintains exceptional purity suitable for high-voltage blocking layers.

Customization Potential & Fabrication Services

Section titled “Customization Potential & Fabrication Services”

The successful fabrication of the lateral PCSS device relied on precise dimensions and a specific metal stack. 6CCVD offers comprehensive customization capabilities to meet these exact engineering requirements:

Requirement from Paper6CCVD CapabilityBenefit to Researcher
Substrate DimensionsCustom plates/wafers up to 125 mm diameter.We can supply the exact 4.5 mm x 4.5 mm plates or larger wafers for scaled production.
ThicknessSCD thickness from 0.1 µm up to 500 µm.The 0.5 mm (500 µm) thickness used is standard, but custom thicknesses are available for specific thermal or electrical requirements.
Metalization StackIn-house deposition of Au, Pt, Pd, Ti, W, Cu.We can replicate the critical Ti (30 nm) / Pt (30 nm) / Au (120 nm) stack used for low-resistance ohmic contacts, ensuring device consistency.
Surface FinishPolishing to Ra < 1 nm (SCD).We provide the necessary double-side polishing (DSP) to achieve the ultra-smooth surface (0.4 nm to 1.2 nm RMS) required for reliable device fabrication and high-voltage operation.
Device GeometryPrecision laser cutting and shaping services.We can pre-cut substrates to specific geometries, reducing post-processing time and material waste for high-volume device fabrication.

6CCVD’s in-house PhD engineering team specializes in the material science of diamond for advanced electronic and optical applications. We offer consultation services to assist researchers in optimizing material selection for similar High-Power Photoconductive Switching projects.

  • Purity Optimization: Assistance in specifying the exact impurity limits required to maintain high carrier mobility and minimize Shockley-Read-Hall recombination centers.
  • Contact Engineering: Guidance on selecting the optimal metal stack and annealing recipe to minimize effective contact resistance (REC), a critical factor identified in the research.
  • Scaling: Support for transitioning from laboratory-scale 4.5 mm x 4.5 mm devices to larger, inch-size wafers for commercial or industrial applications.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Photoconductive semiconductor switches (PCSSs) are fabricated on type IIa diamond substrates with varying boron and nitrogen impurity levels (<1014-1016 cm−3). The photoresponse of lateral PCSS is reported over the incident laser wavelength range (212-240 nm), energy per pulse (5-65 μJ), and DC bias (−1.2 to +1.2 kV). The PCSS device with the lowest boron and nitrogen impurity concentration achieves the highest normalized responsivity of 9.1 × 10−8 A-cm/W-V, peak photocurrent of 8.0 A, and on/off ratio of 2.3 × 1011 at a DC bias of +1.2 kV with the potential for even higher currents at increased DC bias. All PCSS display fast rise times (<3 ns), limited by the laser’s rise time. However, photoresponse measurements reveal that higher impurity levels reduce the photocurrent and decrease the on/off ratio. These results highlight the performance advantages of using low background concentration type IIa diamond substrates for PCSS fabrication and present a promising route toward advanced high-power, high-speed diamond-based switches.

  1. 2010 - 1.55-μm GaNAsSb-based photoconductive switch for microwave switching [Crossref]
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  3. 2018 - Current state of photoconductive semiconductor switch engineering [Crossref]
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