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Управление свойствами алмазоподобных кремнийуглеродных пленок

MetadataDetails
Publication Date2020-01-01
JournalФизика твердого тела
AuthorsА.И. Попов, А.Д. Баринов, В.М. Емец, Т.С. Чуканова, М.Л. Шупегин
Citations2
AnalysisFull AI Review Included

Technical Analysis and Documentation: Advanced Modification of Diamond-Like Silicon-Carbon Films

Section titled “Technical Analysis and Documentation: Advanced Modification of Diamond-Like Silicon-Carbon Films”

This research investigates the effective control of electrophysical and mechanical properties in amorphous diamond-like silicon-carbon (a-SiC:H) films through structural and chemical modification techniques using MPCVD.

  • Modification Methods: Properties were tuned using structural factors (substrate bias voltage, Ar pressure, AC field frequency) and chemical doping (transition metals like Tantalum, Tungsten, and Molybdenum).
  • Mechanical Enhancement: Structural modification via bias voltage increased nanohardness from 22 GPa to 28 GPa and elastic modulus from 135 GPa to 190 GPa, while simultaneously reducing surface roughness (Ra) from 0.9 nm to 0.35 nm.
  • Electrical Tunability: Chemical modification using Tantalum (Ta) doping allowed for conductivity tuning across 9 orders of magnitude, achieving high conductivity up to 103 Ω-1 cm-1, characteristic of a percolation system.
  • Structural-Chemical Interplay: The study highlights the necessity of considering the structural impact of dopants (e.g., carbon extraction from the matrix to form metal carbides) to accurately predict final material properties.
  • 6CCVD Advantage: While a-SiC:H films offer tunability, 6CCVD’s Single Crystal Diamond (SCD) and Polycrystalline Diamond (PCD) provide intrinsic properties (e.g., Hardness > 80 GPa, superior thermal management) that significantly exceed the reported a-SiC:H metrics, offering a direct path to high-performance, stable devices.
ParameterValueUnitContext
Substrate Bias Voltage (Vbias) Range-100 to -1000VStructural Modification
Nanohardness (H) (Low Vbias)22GPaVbias = -200 V
Nanohardness (H) (High Vbias)28GPaVbias = -400 V
Elastic Modulus (E) (High Vbias)190GPaVbias = -400 V
Surface Roughness (Ra) Reduction0.9 to 0.35nmAchieved by increasing Vbias
Argon Pressure (PAr) Range0 to 7.10-4TorrStructural Modification
Conductivity (σ) (No Ar, 1.76 MHz)3.10-12Ω-1 cm-1Baseline PPMS film
Conductivity (σ) (High Ar, 1.76 MHz)1.10-6Ω-1 cm-1PAr = 7.10-4 Torr (6 orders increase)
AC Field Frequency Comparison1.76 and 100MHzAffects conductivity by 2-3 orders
Tantalum (Ta) Doping Concentrationup to 30-35at.%Chemical Modification
Conductivity (σ) Range (Ta Doping)10-6 to 103Ω-1 cm-19 orders of magnitude change
Thermal Cathode Temperature≈ 2500°CPrecursor vaporization
MoC Nanocrystal Size≈ 2.5nmMolybdenum Carbide Phase
WC Nanocrystal Size≈ 1nmTungsten Carbide Phase

The a-SiC:H films were synthesized using a specialized Plasma-Chemical Vapor Deposition (PCVD) setup incorporating a thermal cathode and a magnetron.

  1. Deposition System: PCVD utilizing a tungsten thermal cathode (T ≈ 2500 °C) and a ceramic disperser heated to 300-400 °C for precursor vaporization.
  2. Precursors: Organosilicon compounds, specifically Polyphenylmethylsiloxane (PPMS) and Polymethylsiloxane (PMS), were used as the carbon and silicon sources.
  3. Structural Modification:
    • Control of the kinetic energy of depositing particles via the magnitude of the negative substrate bias voltage (Vbias).
    • Control of plasma characteristics and ion bombardment intensity via Argon partial pressure (PAr).
    • Control of plasma dynamics via the frequency of the axial AC electric field (1.76 MHz vs. 100 kHz).
  4. Chemical Modification: Transition metals (Ta, W, Mo) were introduced into the growing film via magnetron sputtering, achieving concentrations up to 35 at.%.
  5. Characterization Techniques:
    • Elemental Composition: X-ray microanalysis (Inca x-Act) and Energy Dispersive Spectroscopy (EDS).
    • Surface Morphology: Atomic Force Microscopy (AFM, NteGRA Prima).
    • Electrophysical Properties: Dielectric spectroscopy (Novocontrol Alpha-A) and automated measurement systems (ASEC-03E).
    • Mechanical Properties: Nanoindentation using a Berkovich pyramid (NHT2-TTX).

The research demonstrates the complexity required to achieve moderate performance in amorphous diamond-like films. 6CCVD provides high-purity, crystalline diamond materials that inherently surpass the performance metrics of a-SiC:H, offering engineers a simpler path to extreme performance applications (e.g., high-power electronics, extreme environment sensors, and ultra-hard coatings).

Applicable Materials for High-Performance Replication

Section titled “Applicable Materials for High-Performance Replication”
Application Requirement (from Paper)6CCVD Material SolutionKey Performance Advantage
Extreme Hardness/Wear Resistance (Target: 28 GPa)Optical Grade SCD or High-Purity PCDIntrinsic hardness > 80 GPa. SCD offers superior thermal conductivity (> 2000 W/mK) for heat dissipation, critical for high-power devices.
Tunable High Conductivity (Target: 103 Ω-1 cm-1)Heavy Boron-Doped Diamond (BDD)Achieves stable, high conductivity (metallic regime) without relying on complex metal carbide percolation systems. BDD offers superior electrochemical stability.
Ultra-Low Roughness (Target: 0.35 nm)Polished SCD WafersStandard polishing achieves Ra < 1 nm. Our specialized polishing services can meet or exceed the reported roughness for critical optical or electronic interfaces.
Protective/Anti-Friction CoatingsPCD Plates (Inch-Size)Offers large area coverage (up to 125 mm diameter) with high uniformity and mechanical stability (Ra < 5 nm polished).

Customization Potential for Advanced Research

Section titled “Customization Potential for Advanced Research”

6CCVD’s in-house MPCVD and post-processing capabilities are perfectly suited to support researchers looking to extend or transition from a-SiC:H to true crystalline diamond:

  • Custom Dimensions and Thickness: While the paper focuses on thin films, 6CCVD can supply SCD films from 0.1 µm up to 500 µm thick, and PCD plates up to 125 mm in diameter, accommodating large-area applications. Substrates up to 10 mm thick are available for robust mechanical applications.
  • Advanced Doping and Conductivity Control: We offer precise, controlled doping of Boron (BDD) to achieve specific resistivity targets, eliminating the need for complex, structurally disruptive transition metal doping (Ta, W, Mo) used in the paper.
  • Integrated Metalization Services: The paper implies the need for electrical contacts. 6CCVD provides internal metalization capabilities, including standard stacks like Ti/Pt/Au, as well as custom layers of Au, Pt, Pd, Ti, W, and Cu, ensuring robust ohmic or Schottky contacts tailored to specific device architectures.
  • Ultra-Precision Polishing: We guarantee surface roughness Ra < 1 nm for SCD and Ra < 5 nm for inch-size PCD, crucial for minimizing scattering losses and improving interface quality in electronic and optical devices.

The structural-chemical modification methods detailed in this paper are highly complex and sensitive to process parameters (Vbias, PAr, frequency). 6CCVD simplifies the material selection process by providing high-quality, stable, and reproducible SCD and PCD materials. Our in-house PhD team specializes in diamond physics and engineering and can assist researchers in selecting the optimal diamond grade (SCD, PCD, or BDD) to meet specific electrophysical or mechanical requirements for similar protective coating or semiconductor projects.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

The possibilities of controlling the electrophysical and mechanical properties of amorphous diamond-like silicon-carbon films by the methods of structural, chemical and structural-chemical modification are considered. The factors of the structural modification were the bias voltage and its frequency during the synthesis of films, the argon pressure in the vacuum chamber, and precursors with different molecular structures. For chemical and structural-chemical modification, transition metals were introduced into the film with a concentration of up to 30 - 35 at. % The high efficiency of controlling the physical properties of the films by the considered methods is shown.