Quantum Biosensors on Chip - A Review from Electronic and Photonic Integrated Circuits to Future Integrated Quantum Photonic Circuits
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2025-10-22 |
| Journal | Microelectronics |
| Authors | Yasaman Torabi, Shahram Shirani, James P. Reilly |
| Institutions | Bell (Canada), McMaster University |
| Citations | 1 |
| Analysis | Full AI Review Included |
Technical Documentation & Analysis: Integrated Quantum Biosensors
Section titled âTechnical Documentation & Analysis: Integrated Quantum BiosensorsâExecutive Summary
Section titled âExecutive SummaryâThis review highlights the critical role of quantum biosensors, particularly those based on Nitrogen-Vacancy (NV) centers in diamond, as the foundation for next-generation, ultra-sensitive, chip-scale diagnostics. The trajectory toward Integrated Quantum Photonics (IQP) demands high-purity diamond materials and advanced fabrication capabilities, which 6CCVD is uniquely positioned to supply.
- Quantum Advantage: NV center biosensors achieve exceptional sensitivity, reaching the aM-fM Limit of Detection (LOD), significantly surpassing classical limits for molecular and viral detection (e.g., SARS-CoV-2 RNA).
- Material Imperative: High-coherence quantum sensing relies on Single Crystal Diamond (SCD) to host stable NV centers, enabling room-temperature operation (300-700 K).
- Integration Challenge: The primary hurdle for scalable IQP biosensors is the integration of quantum emitters (NV centers), photonic waveguides, and electronic readout circuits onto a single chip, requiring hybrid material platforms (Diamond, SiC, LiNbO3).
- 6CCVD Value Proposition: 6CCVD provides the necessary Optical Grade SCD substrates with ultra-low surface roughness (Ra < 1nm) and custom metalization capabilities essential for minimizing optical loss and integrating microwave control lines for spin manipulation.
- Future Scaling: Our capability to supply large-area PCD wafers (up to 125mm) and custom SCD thicknesses (0.1”m - 500”m) supports the development of scalable, high-density IQP architectures and 3D integration strategies (wafer bonding, TSV).
Technical Specifications
Section titled âTechnical SpecificationsâThe following data points are extracted from the analysis of quantum and integrated circuit biosensors, focusing on performance metrics relevant to diamond material requirements.
| Parameter | Value | Unit | Context |
|---|---|---|---|
| NV Center Limit of Detection (LOD) | ~1 aM - fM | Concentration | Highest sensitivity quantum biosensor platform |
| NV Center Operating Temperature | 300 - 700 | K | Enables room-temperature operation |
| SCD Coherence Time (T) | Milliseconds | Time | NV centers, critical for sensing stability |
| Plasmonic Sensor LOD | ~1 fM - pM | Concentration | Quantum plasmonic sensors (e.g., DNA-linked Au nanoparticles) |
| IQP Waveguide Optical Loss | <1 | dB/cm | Target performance for integrated photonic circuits |
| Si3N4 Phase Shifter Loss | <0.5 | dB | MEMS-based IQP component |
| CMOS SPAD Array Size | 32 x 32 | Pixels | Room-temperature single-photon detection |
| DNA Conductivity (S < 3 nm) | 7.8 | S/m | Quantum tunneling regime in plasmonic sensors |
Key Methodologies
Section titled âKey MethodologiesâThe research reviewed emphasizes the following core methodologies necessary for developing functional quantum biosensors and Integrated Quantum Photonic (IQP) systems:
- NV Center Initialization and Readout: NV centers in diamond are initialized into a well-defined spin state using green laser excitation. The spin state is subsequently read out optically via spin-dependent fluorescence detection.
- Spin Manipulation (ODMR): Microwave radiation is used to drive transitions between the NV center spin levels ($m_s = 0$ and $m_s = \pm 1$), allowing external perturbations (magnetic, electric, thermal) to be measured via shifts in the resonance frequency.
- CMOS/PIC Integration: Fabrication processes compatible with CMOS technology are used to create Photonic Integrated Circuits (PICs) and Electronic Integrated Circuits (EICs), utilizing materials like Silicon-On-Insulator (SOI) and Silicon Nitride (Si3N4).
- Hybrid Material Integration: Future IQP systems require bonding or integration of dissimilar materials (e.g., III-V light sources, SiC, LiNbO3, and Diamond) onto silicon platforms to achieve high quantum coherence and efficient photon coupling.
- Microfluidic Interfacing: Integration of microfluidic channels and flow cells is necessary to bring biological samples into contact with the on-chip sensors (e.g., MEMS cantilevers, waveguide surfaces).
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & Capabilitiesâ6CCVD is the essential partner for researchers and engineers developing diamond-based quantum biosensors and Integrated Quantum Photonic (IQP) systems. Our MPCVD diamond materials and precision fabrication services directly address the critical material and integration challenges identified in this review.
| Research Requirement/Challenge | 6CCVD Solution & Capability | Technical Advantage |
|---|---|---|
| Material for NV Centers (P. 13) | Optical Grade Single Crystal Diamond (SCD) | SCD provides the highest purity and lowest defect density necessary to maximize NV center coherence time (T) for superior room-temperature sensing stability. |
| Integration Complexity & Scaling (P. 22) | Custom Wafer Dimensions & Thickness Control | We supply SCD/PCD plates up to 125mm (PCD) and SCD thicknesses from 0.1”m to 500”m, supporting advanced 3D integration (TSV, wafer bonding) required for scalable IQP systems. |
| Low Photon Collection Efficiency (P. 10) | Ultra-Smooth Polishing (Ra < 1nm) | SCD surfaces polished to Ra < 1nm minimize scattering and optical loss, crucial for maximizing photon extraction efficiency from NV centers and improving the Signal-to-Noise Ratio (SNR). |
| Microwave Spin Manipulation (P. 13) | Custom Metalization Services | In-house deposition of Au, Pt, Pd, Ti, W, and Cu allows researchers to integrate precise microwave control lines and electrodes directly onto the diamond substrate for Optically Detected Magnetic Resonance (ODMR) experiments. |
| Hybrid IQP Platforms (P. 19, P. 22) | Boron-Doped Diamond (BDD) Substrates | We offer BDD for integrated electronic components (e.g., highly conductive electrodes) and custom substrates up to 10mm thick for robust packaging and thermal management in hybrid IQP architectures. |
Engineering Support
Section titled âEngineering Supportâ6CCVDâs in-house PhD team specializes in MPCVD diamond growth and defect engineering. We can assist researchers with material selection, orientation, and post-processing optimization for similar NV Center Magnetometry and Viral Detection projects, ensuring the diamond substrate meets the stringent requirements for quantum coherence and integration with PIC/EIC platforms.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
Quantum biosensors offer a promising route to overcome the sensitivity and specificity limitations of conventional biosensing technologies. Their ability to detect biochemical signals at extremely low concentrations makes them strong candidates for next-generation sensing systems. This paper reviews the current state of quantum biosensors and discusses their future implementation in chip-scale platforms that combine microelectronic and photonic technologies. It covers key quantum biosensing approaches including quantum dots (QDs), and nitrogen-vacancy (NV) centers. This paper also considers their potential compatibility with electronic integrated circuits (EICs), photonic integrated circuits (PICs) and integrated quantum photonic (IQP) systems for future biosensing applications. To our knowledge, this is the first review to systematically connect quantum biosensing technologies with the development of microelectronic and photonic chip-based devices. The goal is to clarify the technological trajectory toward compact, scalable, and high-performance quantum biosensing systems.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2025 - Advancements In Biosensor Technologies: From Nanobiosensors To Biocompatible And Optical Systems For Clinical And Environmental Applications
- 2022 - Recent Progress in Chemometrics Driven Biosensors for Food Application [Crossref]
- 2020 - A 0.5-V Sub-10-ÎŒW 15.28-mΩ/âHz Bio-Impedance Sensor IC With Sub-1° Phase Error [Crossref]
- 2016 - A Glucose Biosensor Using CMOS Potentiostat and Vertically Aligned Carbon Nanofibers [Crossref]
- 2003 - An Integrated Optical Interferometric Nanodevice Based on Silicon Technology for Biosensor Applications [Crossref]
- 2023 - A Point-of-Care Biosensor for Rapid Detection and Differentiation of COVID-19 Virus (SARS-CoV-2) and Influenza Virus Using Subwavelength Grating Micro-Ring Resonator [Crossref]
- 2024 - A Multiplex âDisposable Photonicsâ Biosensor Platform and Its Application to Antibody Profiling in Upper Respiratory Disease [Crossref]