Heat transfer performance of compact TPMS lattice heat sinks via metal additive manufacturing
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2025-09-30 |
| Journal | Progress in Additive Manufacturing |
| Authors | Ganesh Chouhan, Avinash Kumar Namdeo, Ahmet GĂŒner, Khamis Essa, Prveen Bidare |
| Analysis | Full AI Review Included |
Advanced Thermal Management: Leveraging MPCVD Diamond for TPMS Heat Sink Architectures
Section titled âAdvanced Thermal Management: Leveraging MPCVD Diamond for TPMS Heat Sink ArchitecturesâThis technical documentation analyzes the findings of the research paper, âHeat transfer performance of compact TPMS lattice heat sinks via metal additive manufacturing,â and outlines how 6CCVDâs specialized MPCVD diamond materials can provide next-generation solutions for extreme thermal management applications.
Executive Summary
Section titled âExecutive SummaryâThe study validates Triply Periodic Minimal Surface (TPMS) lattice structures, fabricated via Laser Powder Bed Fusion (LPBF) using A20X aluminum alloy, as superior heat dissipation devices.
- Performance Superiority: TPMS heat sinks demonstrated a 25-45% increase in heat transfer efficiency compared to conventional pin-fin designs of equivalent volume.
- Surface Area Maximization: The intricate TPMS geometry achieved up to 200% greater surface area relative to traditional counterparts, crucial for enhanced convection.
- Material Limitation & Opportunity: The research utilized A20X aluminum (moderate thermal conductivity). Future work explicitly calls for hybrid materials (e.g., Cu/Al graded alloys) to leverage high thermal conductivity and reduced weight.
- 6CCVD Value Proposition: By replacing or augmenting the aluminum base plate with Single Crystal Diamond (SCD) or Polycrystalline Diamond (PCD), 6CCVD can provide a thermal conductivity increase of up to 10x (Diamond: ~2000 W/mK vs. A20X: ~180 W/mK).
- Design Validation: The study confirms that compact, complex geometries (15x15x15 mmÂł volume, 1 mm strut thickness) are highly effective, aligning with 6CCVDâs capability to supply custom, high-purity diamond substrates for high-power density electronics.
Technical Specifications
Section titled âTechnical SpecificationsâThe following hard data points were extracted from the LPBF manufacturing and thermal testing of the TPMS heat sinks:
| Parameter | Value | Unit | Context |
|---|---|---|---|
| Heat Sink Volume | 15 x 15 x 15 | mmÂł | Fixed volumetric constraint |
| Strut Thickness | 1 | mm | Consistent across all TPMS lattices |
| Unit Cell Sizes (UC) | 5 and 10 | mm | Used for periodicity variation |
| Base Material | A20X Aluminum Alloy | N/A | Precipitation-hardening Al-Cu-Ag-Mg-TiB2 |
| Alloy Density | 2.85 | g/cmÂł | A20X material property |
| LPBF Laser Power | 200 | W | Optimized process variable |
| LPBF Layer Thickness | 30 | ”m | Optimized process variable |
| Energy Density | 88 | J/mmÂł | Optimized process variable |
| Max Surface Area (Split P UC5) | 5698.24 | mmÂČ | Highest measured TPMS surface area |
| Surface Area Enhancement | Up to 200 | % | Compared to conventional heat sinks |
| Max Thermal Gradient (Split P UC10) | 12.86 | °C | Maximum temperature difference observed |
| Heat Transfer Enhancement | 25-45 | % | TPMS vs. conventional pin-fin sinks |
| Max Input Power Tested | 30 | W | Used for thermal evaluation |
Key Methodologies
Section titled âKey MethodologiesâThe experimental procedure focused on designing, manufacturing, and rigorously testing the thermal performance of the TPMS lattices.
- Design and Modeling: TPMS lattice structures (Gyroid, Diamond, Schwarz, Lidinoid, Split P) were designed using nTopology software, focusing on maximizing surface area-to-volume ratio.
- Material Selection: Gas-atomized A20X aluminum powder (mean grain size 40 ”m, distribution 20-60 ”m) was selected for its mechanical strength, low density, and thermal conductivity.
- Additive Manufacturing (LPBF): Samples were fabricated using a Concept Laser M2 system with optimized parameters:
- Laser power: 200 W.
- Hatch spacing: 52.5 ”m.
- Layer thickness: 30 ”m.
- Chamber atmosphere: Argon, oxygen content below 0.1%.
- Experimental Testing: A customized test rig was developed to validate numerical results under steady-state conduction assumptions.
- Setup Components: DC power supply (10 W, 20 W, 30 W input), copper cylinder block (20 mm diameter, 50 mm height), 980 W band heater, and high-precision NTC temperature sensors (accuracy validated 35-105 °C).
- Thermal Interface: Thermal paste was applied between the heat sink and the copper substrate to ensure optimal thermal conductivity and minimize interface resistance.
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & CapabilitiesâThe research highlights the critical need for materials with superior thermal conductivity to maximize the efficiency of complex, compact heat sink geometries. 6CCVDâs MPCVD diamond materials are the ideal solution for replicating and extending this research into high-power density applications.
Applicable Materials: Extreme Thermal Spreading
Section titled âApplicable Materials: Extreme Thermal SpreadingâThe A20X aluminum alloy used in the study is thermally limited. To achieve the next level of performance required for high-frequency electronics, laser diodes, and aerospace components, the base heat spreader must utilize diamond.
| 6CCVD Material | Description | Application Relevance to TPMS Research |
|---|---|---|
| Optical Grade Single Crystal Diamond (SCD) | Highest purity, thermal conductivity up to 2000 W/mK. Ra < 1 nm polishing available. | Ideal for the base plate/substrate of the TPMS heat sink, ensuring maximum heat extraction from the source (e.g., high-power chip) before transfer to the lattice structure. |
| Thermal Grade Polycrystalline Diamond (PCD) | High thermal conductivity (up to 1800 W/mK) in larger formats. Plates up to 125 mm available. | Perfect for large-area heat spreaders or hybrid structures where the TPMS lattice (AM metal) is bonded directly to the diamond base. |
| Boron-Doped Diamond (BDD) | Electrically conductive diamond. | Relevant for electro-thermal applications where the heat spreader must also serve as an electrode or sensor platform, offering robust thermal and electrical performance. |
Customization Potential for Advanced Heat Sinks
Section titled âCustomization Potential for Advanced Heat SinksâThe paper emphasizes the importance of precise geometry and future hybrid material strategies. 6CCVD offers the necessary customization to integrate diamond into these advanced thermal designs.
- Custom Dimensions: We provide SCD and PCD plates/wafers in custom dimensions and thicknesses (SCD: 0.1 ”m - 500 ”m; PCD: 0.1 ”m - 500 ”m) to match the required 15x15 mmÂČ footprint or larger designs (up to 125 mm PCD). Substrates up to 10 mm thick are available for robust base plates.
- Interface Optimization (Metalization): The future work suggests hybrid materials (e.g., Cu/Al). 6CCVD offers in-house metalization services (Au, Pt, Pd, Ti, W, Cu) to create robust, low-thermal-resistance interfaces for bonding the high-conductivity diamond base to the additively manufactured metal lattice structure.
- Surface Finish: We provide ultra-smooth polishing (Ra < 1 nm for SCD, Ra < 5 nm for inch-size PCD), minimizing thermal contact resistance at the critical heat source interface.
Engineering Support
Section titled âEngineering Supportâ6CCVDâs in-house PhD team specializes in optimizing diamond material properties for extreme environments. We can assist researchers and engineers in selecting the optimal diamond grade, thickness, and metalization scheme required to integrate with complex AM geometries for high-power density thermal management projects, ensuring maximum thermal efficiency and mechanical robustness.
Call to Action: For custom specifications or material consultation regarding the integration of high-performance diamond into TPMS or other advanced thermal architectures, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
Abstract Nature-inspired triply periodic minimal surface (TPMS) lattices serve as exemplary models for advanced thermal management strategies. Their intricate geometric and topological configurations enhance surface area, porosity, and smooth curved walls, optimizing thermal performance across diverse applications. These attributes render TPMS structures exceptionally effective in augmenting heat sink performance within a constrained volume, outperforming conventional designs such as pin fin heat sinks. The present study evaluates the thermal performance of five L-PBF manufactured TPMS heat sinks (Gyroid, Diamond, Schwarz, Lidinoid, and Split P) relative to conventional pin-fin heat sinks of equivalent volume. The investigation focuses on the effect of unit cell sizes and periodicity on thermal performance, providing deeper insights into heat transfer mechanisms in TPMS-based structures. To accurately replicate the thermal characteristics, both numerical simulations and experimental testing were conducted. A customized testing system was developed to assess A20X aluminum heat sinks, revealing uniform heat flow across the lattice samples. Overall, this study indicates potential for improved heat transfer and validates the superior performance of TPMS heat sinks over traditional designs.