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Formation of Micrometer‐Sized Textured Hexagonal Silicon Crystals via Nanoindentation

MetadataDetails
Publication Date2025-03-02
JournalSmall Structures
AuthorsM. Bikerouin, Anna Marzegalli, Davide Spirito, Gerald J.K. Schaffar, Corrado Bongiorno
InstitutionsLeibniz Institute for High Performance Microelectronics, Montanuniversität Leoben
Citations2
AnalysisFull AI Review Included

Technical Documentation & Analysis: Hexagonal Silicon Formation via Nanoindentation

Section titled “Technical Documentation & Analysis: Hexagonal Silicon Formation via Nanoindentation”

This research successfully demonstrates a scalable, controlled method for synthesizing high-quality, micrometer-sized, textured hexagonal diamond silicon (hd-Si) crystals, a critical material for next-generation optoelectronics.

  • Core Achievement: Successful transformation of monocrystalline silicon (dc-Si) into the metastable hd-Si (Si-IV) phase using high-pressure nanoindentation followed by low-temperature annealing (250 °C).
  • Methodology: Utilized spherical diamond indenters and optimized loading/unloading rates to induce pressure-driven phase transitions (dc-Si $\rightarrow$ $\beta$-Sn $\rightarrow$ bc8/r8 $\rightarrow$ hd-Si).
  • Material Quality: The resulting hd-Si domains (Group-I pits) exhibit remarkable uniformity, micrometer-scale size, and are free from visible cracks, indicating high crystal quality.
  • Structural Findings: hd-Si is confirmed to be a textured assembly of nanometer-sized grains with slight misorientations, rather than a true monocrystal, offering unique opportunities to tailor optical and electronic anisotropy.
  • Optoelectronic Relevance: hd-Si serves as a promising template for the epitaxial growth of direct-bandgap SiGe alloys, essential for high-mobility electronic devices and on-chip photonics.
  • 6CCVD Relevance: The study underscores the necessity of ultra-hard, high-precision diamond tools (indenters) and advanced material characterization, aligning with 6CCVD’s expertise in high-purity MPCVD diamond substrates and custom fabrication.
ParameterValueUnitContext
Indenter Tip Radius20 and 10µmSpherical diamond tips used for high-pressure application
Maximum Load (Pmax)665mNOptimized load for 20 µm tip, yielding Group-I (crack-free) pits
Loading Strain Rate ($\dot{\epsilon}$)10-3s-1Constant rate used during nanoindentation
Unloading Rate ($\dot{P}$)1mN s-1Slow rate performed to favor crystalline transformation over amorphization
Phase Transformation Onset Pressure10-11GPaPressure required to initiate dc-Si $\rightarrow$ $\beta$-Sn transition
Annealing Temperature250°CPerformed in nitrogen atmosphere for thermal stabilization
Annealing Time2hDuration required for bc8/r8 $\rightarrow$ hd-Si transformation
hd-Si Raman Peak (E2g)487.2 ± 7.5cm-1Experimental frequency (post-annealing)
hd-Si Raman Peak (A1g/E1g)518.4 ± 6.2cm-1Experimental frequency (post-annealing)
hd-Si EELS Plasmon Peak16.7eVRedshift relative to dc-Si (17.0 eV), indicating phase-dependent optical properties
Transformed Domain SizeMicrometerscaleUniform, large domains achieved in Group-I pits
hd-Si StructureTextured NanocrystallineN/ANanometer-sized grains with slight misorientations

The successful synthesis of textured hd-Si relied on precise control of mechanical stress and subsequent thermal treatment, validated by advanced spectroscopic and microscopic techniques.

  1. Nanoindentation: Experiments were performed on monocrystalline Si (001) using spherical diamond indenters (10 µm and 20 µm radii). Optimized loading (constant strain rate of 10-3 s-1) and slow unloading (1 mN s-1) were critical to guide the transformation pathway toward stable crystalline intermediate phases (bc8/r8) and minimize cracking.
  2. Phase Induction: Maximum loads (up to 665 mN) were applied to exceed the 10-11 GPa transformation threshold, resulting in the formation of the metallic $\beta$-Sn phase, which subsequently transformed into the metastable bc8 (Si-III) and r8 (Si-XII) phases upon pressure release.
  3. Thermal Annealing: Samples were annealed at 250 °C for 2 hours in a nitrogen atmosphere. This low-temperature annealing step drove the complete structural transformation of the bc8/r8 mixture into the desired hexagonal diamond silicon (hd-Si).
  4. Structural Characterization: The resulting phases were analyzed using state-of-the-art techniques:
    • Polarized Raman Spectroscopy: Used to identify specific phonon modes (e.g., 487.2 cm-1 for hd-Si) and confirm the high crystallographic coherence and preferred orientation of the metastable phases.
    • High-Resolution TEM/STEM: Confirmed the micrometer-scale size and textured nanocrystalline nature of the hd-Si domains, revealing nanometer-sized grains (5-30 nm) with slight misorientations.
    • EELS (Electron Energy-Loss Spectroscopy): Provided confirmation of phase-dependent optical properties, showing a characteristic plasmon peak redshift (16.7 eV for hd-Si).
  5. Computational Validation: Experimental results were supported by Density Functional Theory (DFT) calculations and Molecular Dynamics (MD) simulations using ML-based interatomic potentials, providing robust insights into the stress-induced phase transition mechanisms.

This research highlights the critical role of high-performance diamond materials in high-pressure processing and the development of advanced semiconductor templates. 6CCVD is uniquely positioned to support the replication and industrial scaling of this technology through our specialized MPCVD diamond products and custom engineering services.

Applicable Materials for Replication and Extension

Section titled “Applicable Materials for Replication and Extension”

The synthesis of hd-Si is a foundational step for future SiGe optoelectronic devices. 6CCVD provides the high-purity diamond materials necessary for both the processing tools and the resulting device structures.

Application Requirement6CCVD Material SolutionTechnical Advantage
High-Precision Indentation ToolsMechanical Grade SCDExtreme hardness and wear resistance required for high-pressure phase transformation (10-11 GPa).
Optoelectronic TemplatesOptical Grade SCDHigh purity, low defect density (Ra < 1 nm polishing available) ideal for subsequent epitaxial growth of SiGe alloys on hd-Si.
High-Mobility DevicesHigh-Purity PCD (up to 125mm)Enables scaling of the nanoindentation process to larger wafer sizes, crucial for industrial integration and high-volume manufacturing.
Integrated Electrodes/SensorsBoron-Doped Diamond (BDD)Customizable doping levels for creating highly conductive, chemically inert electrodes or active sensing layers adjacent to the transformed Si.

Customization Potential for Advanced Research

Section titled “Customization Potential for Advanced Research”

The complexity of nanoindentation and subsequent characterization often requires non-standard material dimensions and surface treatments. 6CCVD specializes in delivering custom specifications to meet precise research needs.

  • Custom Dimensions: While the paper used small silicon samples, scaling this process requires larger substrates. 6CCVD offers Polycrystalline Diamond (PCD) plates up to 125mm in diameter, enabling large-area processing for industrial feasibility studies.
  • Precision Thickness Control: We provide SCD and PCD wafers with thicknesses ranging from 0.1 µm up to 500 µm, allowing researchers to precisely control the mechanical boundary conditions and stress distribution during indentation, optimizing the Group-I (crack-free) pit formation.
  • Custom Metalization Services: The paper utilized protective carbon layers (EBID/IBID) for cross-sectional analysis. 6CCVD offers in-house metalization capabilities (Au, Pt, Pd, Ti, W, Cu), essential for creating precise contact pads, electrodes, or protective layers for advanced TEM/STEM sample preparation and device integration.
  • Ultra-Smooth Polishing: To ensure minimal surface defects that could initiate cracking (as seen in Group-II pits), 6CCVD guarantees SCD polishing to Ra < 1 nm and inch-size PCD polishing to Ra < 5 nm, providing the ideal starting surface for high-fidelity nanoindentation experiments.

6CCVD’s in-house PhD material science team understands the complex interplay between stress, phase stability, and crystal structure demonstrated in this research. We offer authoritative professional support for projects involving:

  • Material Selection: Assisting researchers in selecting the optimal diamond grade (SCD vs. PCD) and geometry for high-pressure applications, ensuring maximum tool life and transformation efficiency.
  • Process Optimization: Consulting on material specifications for similar pressure-induced phase transformation projects or epitaxial growth templates (e.g., SiGe on hd-Si), leveraging diamond’s unique thermal and mechanical properties.
  • Custom Fabrication: Providing rapid prototyping and global shipping (DDU default, DDP available) of custom diamond components tailored for advanced semiconductor and optoelectronic device fabrication.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

A comprehensive study on the formation of micrometer‐sized, textured hexagonal diamond silicon (hd‐Si) crystals via nanoindentation followed by annealing is presented. Utilizing advanced characterization techniques such as polarized Raman spectroscopy, high‐resolution transmission electron microscopy, and electron energy‐loss spectroscopy, the successful transformation of silicon into high‐quality hd‐Si is demonstrated. The experimental results are further supported by first‐principles calculations and molecular dynamics simulations. Notably, the hd‐Si phase consists of nanometer‐sized grains with slight misorientations, organized into large micrometer‐scale textured domains. These findings underscore the potential of nanoindentation as a precise and versatile tool for inducing pressure‐driven phase transformations, particularly for the stabilization of hexagonal silicon. The textured nature of hd‐Si also presents a unique opportunity to tailor its optical properties, opening new avenues for its application in semiconductor and optoelectronic devices.