Investigating the Influence of Laser-Etched Straight and Wavy Textures on Grinding Efficiency and Tool Quality of WC–Co Carbide Cutting Tools

At a Glance

Metadata	Details
Publication Date	2025-01-24
Journal	Materials
Authors	Chao Li, Tielin Li, Xiaohong Zhang, Tianzhongsen He, Lijuan Su
Institutions	Hunan Institute of Science and Technology
Citations	3
Analysis	Full AI Review Included

Technical Documentation & Analysis: Laser-Assisted Grinding of WC-Co Carbide Tools

This document analyzes the research paper “Investigating the Influence of Laser-Etched Straight and Wavy Textures on Grinding Efficiency and Tool Quality of WC-Co Carbide Cutting Tools” to highlight key technical achievements and propose superior material solutions and services offered by 6CCVD.

Executive Summary

The study successfully demonstrated that laser surface texturing significantly enhances the grinding efficiency and tool quality of WC-Co cemented carbide, providing a valuable pathway for high-efficiency, low-loss tool manufacturing.

Performance Optimization: Laser texturing, particularly the wavy pattern, achieved maximum reductions of 53.7% in normal grinding force and 51.2% in tangential grinding force compared to untextured tools.
Surface Quality Improvement: The wavy texture reduced surface roughness (Ra) by up to 38.9%, attributed to improved coolant flow and uniform stress distribution.
Edge Integrity: Laser texturing extended the acceptable grinding depth for maintaining tool edge specification from 10 µm (untextured) to 20 µm (textured), achieving a maximum reduction in edge chipping of 66.6%.
Mechanism: The ultrafast picosecond laser created microfluidic channels (150 µm width, 120 µm depth) that enhanced chip evacuation and coolant penetration, mitigating thermal damage and abrasive chip adhesion.
Application Validation: Tools processed via laser-assisted grinding showed superior performance when turning Carbon Fiber Reinforced Composites (CFRP), resulting in less fiber pull-out and fewer voids.
Methodology: Ultrafast picosecond pulsed laser ablation was used to create precise straight and wavy textures on the WC-Co surface prior to grinding with a resin-bonded diamond wheel.

Technical Specifications

The following hard data points were extracted from the experimental results and methodology sections of the paper:

Parameter	Value	Unit	Context
Max Normal Grinding Force Reduction	53.7	%	Wavy texture vs. Untextured
Max Tangential Grinding Force Reduction	51.2	%	Wavy texture vs. Untextured
Max Surface Roughness (Ra) Reduction	38.9	%	Wavy texture, compared to untextured
Max Edge Chipping Reduction	66.6	%	Wavy texture, compared to untextured
WC-Co Material Hardness	1700	HV	Workpiece material property
Laser Type Used	Picosecond Pulsed	N/A	Ultrafast ablation source
Average Laser Power (P_avg)	9.5	W	Laser machining parameters
Laser Pulse Frequency (f_p)	60	kHz	Laser machining parameters
Texture Groove Width (W)	150	µm	Straight and Wavy patterns
Texture Groove Depth (H)	120	µm	Straight and Wavy patterns
Grinding Wheel Type	Resin-bonded diamond	SD100	Grinding experiment setup
Grinding Speed (V_s)	30	m/s	Plane grinding experiment
Maximum Grinding Depth (a_p)	20	µm	Depth where textured tool remained in spec

Key Methodologies

The experimental procedure focused on precision laser texturing followed by controlled grinding and performance validation:

Material Preparation: WC-Co cemented carbide blanks (94 wt% WC, 6 wt% Co) were sourced and prepared for surface modification.
Laser Texturing Setup: An ultrafast picosecond pulsed laser system (BC-2900) was utilized, operating at 60 kHz pulse frequency and 9.5 W average power.
Texture Pattern Design: Two distinct patterns (straight and wavy) were designed and etched, featuring a nominal width of 150 µm and a depth of 120 µm. The patterns were aligned with the wheel feed direction.
Post-Ablation Cleaning: Tools were ultrasonically cleaned in anhydrous ethanol for 10 minutes to remove debris and recast layer material, followed by nitrogen gas drying.
Grinding Experiments: Plane grinding was performed using a CNC high-precision grinder and a resin-bonded diamond wheel (SD100) at a speed of 30 m/s. Water-based coolant was supplied continuously (3% concentration, 25 L/min).
Data Acquisition: Grinding forces (normal and tangential) were measured using a Kistler 9272 force gauge system.
Quality Analysis: Surface morphology, surface roughness (Ra), and edge chipping were assessed using a laser confocal microscope (LEXT OLS5000).
Application Testing: Tools were used to turn T800H CFRP rods under dry cutting conditions to validate the improved edge quality on composite machining performance.

6CCVD Solutions & Capabilities

The research demonstrates the critical role of surface integrity and micro-texturing in optimizing the performance of ultra-hard tools. 6CCVD specializes in providing the foundational material—MPCVD diamond—and the necessary precision processing capabilities to replicate and significantly advance this research, particularly for high-value applications like CFRP machining.

Research Requirement/Challenge	6CCVD Solution & Capability	Value Proposition
High Hardness Tool Material (WC-Co)	Single Crystal Diamond (SCD) Plates or Polycrystalline Diamond (PCD) Wafers	Diamond offers superior hardness, wear resistance, and thermal stability compared to WC-Co. Utilizing 6CCVD SCD or PCD provides the ultimate platform for high-efficiency, low-loss machining of composites (CFRP) and hard alloys.
Precision Laser Texturing (150 µm features)	Custom Laser Processing & Etching Services	6CCVD utilizes advanced laser systems for high-precision cutting and etching of diamond materials. We can replicate or optimize microfluidic channel designs (straight/wavy) directly onto the diamond surface for enhanced tribological performance.
Achieving Ultra-Low Surface Roughness (Ra)	Ultra-Precision Polishing (Ra < 1nm SCD)	While texturing reduced Ra, 6CCVD guarantees industry-leading surface finishes (Ra < 1nm for SCD; Ra < 5nm for inch-size PCD) crucial for minimizing friction and maximizing tool life in precision grinding and cutting.
Custom Tool Dimensions (20 x 10 x 4 mm)	Custom Dimensions up to 125 mm	We supply SCD and PCD plates/wafers in custom sizes and thicknesses (SCD/PCD 0.1 µm - 500 µm) tailored precisely to proprietary tool geometries and grinding fixtures. We also offer substrates up to 10 mm thick.
Advanced Tool Integration	In-House Metalization Services	For complex tool integration, brazing, or sensor embedding, 6CCVD offers custom metalization layers (Au, Pt, Pd, Ti, W, Cu) directly onto the diamond surface, ensuring robust mechanical and electrical interfaces.

Applicable Materials

To replicate or extend this research using the highest performance materials, 6CCVD recommends:

Optical Grade SCD: Ideal for applications requiring the absolute sharpest edge quality and lowest surface roughness (Ra < 1nm), critical for minimizing edge chipping during precision grinding.
High-Wear Resistance PCD: Recommended for large-scale composite (CFRP) machining where high toughness and large area coverage (up to 125 mm diameter) are required.

Customization Potential

The success of this research hinges on precise geometric control. 6CCVD offers:

Custom Laser Cutting: We provide precise laser cutting services to shape diamond wafers into complex tool geometries, ensuring alignment with the required grinding direction, as demonstrated in the paper.
Metalization for Tool Mounting: If the textured tools require brazing or mounting into a fixture, 6CCVD can apply custom metalization stacks (e.g., Ti/Pt/Au) to ensure reliable bonding.

Engineering Support

The findings regarding the optimization of grinding forces and edge quality through laser texturing are highly relevant to advanced manufacturing. 6CCVD’s in-house PhD team can assist with material selection and specification for similar laser-assisted grinding or CFRP machining projects, ensuring the optimal CVD diamond grade is chosen for maximum performance gains.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

WC-Co cemented carbide has been widely used as machining tool material due to its good mechanical properties. Grinding is an important process in the manufacture of cemented carbide tools. When grinding tools, there are problems such as excessive grinding force, small chip space, and poor lubrication and cooling performance, which in turn contribute to surface defects such as burrs, burns, and even edge damage such as edge chipping. These problems constrain the use of carbide tools, so that the cutting force is unstable and the machining surface quality is poor when the tool is in service. In this paper, straight-line and wavy-texture patterns were designed and formed on the surface of WC-Co tools using a picosecond laser. Grinding experiments were conducted on the ablated tool using a resin-bonded diamond wheel, and surface morphology, roughness, grinding force, and cutting edge quality were evaluated. Finally, turning experiments were conducted to compare the cutting performance of the tools after conventional and laser-assisted grinding. The experimental results showed that the tools with wavy texture showed superior surface and cutting edge quality, with 53.7% and 51.2% reduction in normal and tangential grinding forces, respectively, and 66.6% maximum reduction in edge chipping for the wavy textured tools. Therefore, this study not only reveals the advantages of laser-assisted grinding in machining WC-Co cutting tools, but also provides a valuable theoretical basis for realizing high-efficiency and low-loss tool machining.

Tech Support

Original Source

DOI: https://doi.org/10.3390/ma18030528

References

2022 - Effect of laser surface texturing on the wettability of WC-Co cutting tools
2020 - Wear mechanism of WC-Co cemented carbide tool in cutting Ti-6Al-4V based on thermodynamics [Crossref]
2020 - Multi-pattern failure modes and wear mechanisms of WC-Co tools in turning Ti-6Al- 4V [Crossref]
2020 - Effect of carbon content on microstructure and mechanical properties of WC-10Co cemented carbides with plate-like WC grain [Crossref]
2020 - Surface roughness profile and its effect on coating adhesion and corrosion protection: A review [Crossref]
2023 - Improved grinding performance of SiC using an innovative bionic vein-like structured grinding wheel optimized by hydrodynamics [Crossref]
2020 - Study on the optical quality and strength of glass edges after the grinding and polishing process [Crossref]
2020 - Surface analysis of WC-5%Co cemented tungsten carbide cutting insert after plunge-face grinding [Crossref]
2015 - Significant influence factors on the grinding tool wear and cutting mechanisms during grinding of PCBN inserts [Crossref]
2021 - Effect of the grinding process on the wear of a cemented tungsten carbide cutting insert during turning [Crossref]