Skip to content

Effects of the In Situ Growth of CNTs on Ti-Coated Diamond Surfaces on the Mechanical Properties of Diamond/Aluminum Composites

MetadataDetails
Publication Date2024-04-07
JournalNanomaterials
AuthorsHao Wu, Ping Zhu, Yixiao Xia, Yifu Ma, Junyao Ding
InstitutionsHarbin Institute of Technology, Nanjing University of Science and Technology
Citations2
AnalysisFull AI Review Included

Technical Documentation & Analysis: Multi-Scale Diamond Interface Engineering

Section titled “Technical Documentation & Analysis: Multi-Scale Diamond Interface Engineering”

This research successfully demonstrates a multi-scale interface modification strategy for enhancing the mechanical reliability of diamond/aluminum (D/Al) composites, critical for advanced thermal management applications.

  • Core Achievement: In situ growth of Carbon Nanotubes (CNTs) on Ti-coated diamond particles significantly improved the bending strength of the resulting D/Al composite by approximately 9%.
  • Performance Metrics: The CNT-modified composite achieved a maximum bending strength of 275 ± 6 MPa, compared to 252 ± 9 MPa for uncoated D/Al.
  • Interface Mechanism: The CNT layer facilitated robust chemical bonding by promoting the formation of bridging phases (TiC and Al4C3) during the Gas-Assisted Pressure Infiltration (GPI) process.
  • Methodology: Monocrystalline diamond particles (355 ”m) were coated with 300 nm of Ti via magnetron sputtering, followed by Fe catalyst application and subsequent CNT growth (approx. 1 ”m length) using Plasma-Enhanced Chemical Vapor Deposition (PECVD) at 650 °C.
  • Trade-off: While mechanical strength was maximized, the thermal conductivity was reduced (577 W·m-1·K-1) compared to the uncoated composite (726 W·m-1·K-1), attributed to increased interface thermal resistance from thicker interfacial phases (TiC, Al3Ti).
  • Strategic Value: This work provides a proven pathway for designing high-reliability diamond/metal composites where mechanical integrity is paramount alongside acceptable thermal performance.

The following hard data points were extracted from the experimental results and preparation parameters:

ParameterValueUnitContext
Diamond Particle TypeMBD4N/AMonocrystalline Diamond (SCD precursor)
Diamond Particle Size355”mReinforcement average size
Diamond Volume Fraction60%Composite composition
Ti Coating Thickness300nmApplied via magnetron sputtering
CNT Length (In Situ Growth)~1”mGrown via PECVD
PECVD Growth Temperature650°CHeld for 30 min
PECVD RF Frequency13.56MHzUsed to generate plasma
PECVD Pressure140-160PaTotal pressure during CNT growth
GPI Infiltration Temperature800°CAluminum heating temperature
GPI Infiltration Pressure15MPaGas pressure applied
Max Bending Strength275 ± 6MPaCNT-modified Ti-coated D/Al composite
Max Thermal Conductivity726W·m-1·K-1Uncoated D/Al composite
CNT-Modified Thermal Conductivity577W·m-1·K-1Demonstrates mechanical/thermal balance

The preparation of the multi-scale CNT-modified Ti-coated diamond reinforcement involved precise sequential steps:

  1. Ti Coating: Monocrystalline diamond particles were coated with a 300 nm Ti layer using magnetron sputtering.
  2. Catalyst Precursor Application: The Ti-coated diamond was immersed in a 0.05 mol/L Fe(NO3)3·9H2O solution for 12 hours (solution impregnation method) to encapsulate the Fe catalyst precursor.
  3. PECVD Setup: The particles were transferred to a PECVD reactor chamber. Methane (CH4) served as the carbon source, and Hydrogen (H2) served as the reducing and carrier gas.
  4. Fe Reduction: The system was heated to 650 °C (10 °C/min rate) and held for 30 min under H2 flow (20 sccm) to reduce Fe3+ to metallic Fe catalyst particles.
  5. CNT Growth: RF power (13.56 MHz) was applied for 20 minutes to generate plasma. CH4/H2 mixture (20/5 sccm flow rate) was introduced at 140-160 Pa pressure to grow CNTs in situ.
  6. Composite Fabrication: CNT-modified diamond particles (60 vol.%) were infiltrated with molten 1060 bulk aluminum using the Gas-Assisted Pressure Infiltration (GPI) method at 800 °C and 15 MPa pressure.

6CCVD specializes in providing the high-quality MPCVD diamond materials and precision engineering services required to replicate and advance this critical research in high-reliability diamond/metal composites.

To replicate or extend this research, high-purity diamond material is essential for consistent interface chemistry and thermal performance:

  • Optical Grade SCD (Single Crystal Diamond): The MBD4 particles used are precursors to high-quality SCD. 6CCVD provides high-purity, low-defect SCD plates and wafers (0.1 ”m to 500 ”m thick) ideal for thermal management research requiring superior intrinsic properties and consistent crystallographic orientation.
  • PCD (Polycrystalline Diamond): For scaling up composite production or applications requiring larger reinforcement sizes, 6CCVD offers high-quality PCD plates up to 125mm in diameter, suitable for large-area heat spreaders.

The success of this study hinges on precise material modification, a core competency of 6CCVD:

Research Requirement6CCVD CapabilityTechnical Advantage
Ti Coating (300 nm)Internal Metalization Services6CCVD offers precise, internal metalization via sputtering, routinely handling Ti, W, Au, Pt, Pd, and Cu layers, ensuring exact thickness control (e.g., 300 nm ± 10 nm).
Particle Surface QualityAdvanced PolishingWe provide ultra-smooth polishing (Ra < 1nm for SCD, < 5nm for inch-size PCD), ensuring optimal surface preparation for subsequent catalyst deposition and PECVD growth.
Custom DimensionsLarge Format & Custom ThicknessWe supply diamond substrates in custom dimensions up to 125mm (PCD) and thicknesses up to 10mm, enabling direct integration into advanced electronic packaging designs, moving beyond particle-based composites.
Interface Chemistry ControlBoron-Doped Diamond (BDD)For research extending into electrochemical or sensing applications related to the interface, 6CCVD offers BDD materials, providing tunable electrical properties alongside thermal performance.

6CCVD’s in-house PhD team specializes in MPCVD growth parameters and interface modification strategies. We can assist researchers in optimizing material selection and pre-treatment protocols (e.g., surface termination, metalization thickness, and catalyst preparation) for similar Diamond/Metal Composite projects. Our expertise ensures the desired balance between mechanical reliability (as achieved in this study) and thermal performance for specific application requirements.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Diamond/aluminum composites have attracted significant attention as novel thermal management materials, with their interfacial bonding state and configuration playing a crucial role in determining their thermal conductivity and mechanical properties. The present work aims to evaluate the bending strength and thermal conductivity of CNT-modified Ti-coated diamond/aluminum composites with multi-scale structures. The Fe catalyst was encapsulated on the surface of Ti-coated diamond particles using the solution impregnation method, and CNTs were grown in situ on the surface of Ti-coated diamond particles using the plasma-enhanced chemical vapor deposition (PECVD) method. We investigated the influence of interface structure on the thermal conductivity and mechanical properties of diamond/aluminum composites. The results show that the CNT-modified Ti-coated diamond/aluminum composite exhibits excellent bending strength, reaching up to 281 MPa, compared to uncoated diamond/aluminum composites and Ti-coated diamond/aluminum composites. The selective bonding between diamond and aluminum was improved by the interfacial reaction between Ti and diamond particles, as well as between CNT and Al. This led to the enhanced mechanical properties of Ti-coated diamond/aluminum composites while maintaining acceptable thermal conductivity. This work provides insights into the interface’s configuration design and the performance optimization of diamond/metal composites for thermal management.

  1. 2020 - A review on advanced carbon-based thermal interface materials for electronic devices [Crossref]
  2. 2020 - Three-dimensional interconnected networks for thermally conductive polymer composites: Design, preparation, properties, and mechanisms [Crossref]
  3. 2016 - Efficient on-chip hotspot removal combined solution of thermoelectric cooler and mini-channel heat sink [Crossref]
  4. 2021 - Improvement of thermal conductivity of diamond/Al composites by optimization of liquid-solid separation process [Crossref]
  5. 2018 - Enhanced thermal conductivity of diamond/aluminum composites through tuning diamond particle dispersion [Crossref]
  6. 2022 - Realizing ultrahigh thermal conductivity in bimodal-diamond/Al composites via interface engineering
  7. 2010 - Microstructure and thermal properties of diamond/aluminum composites with TiC coating on diamond particles [Crossref]
  8. 2017 - Enhanced thermal conductivity in Diamond/Aluminum composites with tungsten coatings on diamond particles prepared by magnetron sputtering method [Crossref]
  9. 2018 - Thermal conductivity of metal matrix composites with coated inclusions: A new modelling approach for interface engineering design in thermal management [Crossref]
  10. 2013 - Optimizing thermal conductivity in gas-pressure infiltrated aluminum/diamond composites by precise processing control [Crossref]