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Performance Evaluation of a Double-Helical-Type-Channel Reinforced Heat Sink Based on Energy and Entropy-Generation Analysis

MetadataDetails
Publication Date2024-03-17
JournalProcesses
AuthorsHe Liyi, Xue Hu, Lixin Zhang, Feng Chen, Xinwang Zhang
InstitutionsXinjiang Production and Construction Corps, Shihezi University
Citations3
AnalysisFull AI Review Included

Technical Documentation & Analysis: Diamond Heat Sinks for High-Power Electronics

Section titled “Technical Documentation & Analysis: Diamond Heat Sinks for High-Power Electronics”

This analysis evaluates the research on double-helical-type-channel heat sinks, focusing on the optimization of rib architecture for enhanced thermal and hydraulic performance in high-power electronic cooling applications (1451 W load).

  • Application Focus: Performance enhancement of liquid-cooled heat sinks for miniaturized and highly integrated electronic devices, addressing critical overheating risks.
  • Optimization Target: Five rib geometries (Elliptic, Rectangular, Diamond, Drop-shaped, Frustum) were tested under turbulent flow conditions (Reynolds number 10,000-60,000).
  • Key Finding (Thermal): The Elliptic Rib (FC-ER) configuration demonstrated superior thermal performance, achieving the lowest average temperature (47.51 °C at Re=20,000) and highest temperature uniformity.
  • Performance Gain: FC-ER yielded a Nusselt number improvement ranging from 15.80% to 30.77% compared to a smooth channel (SFC).
  • Efficiency Metric: FC-ER achieved the lowest augmentation entropy-generation number (Ns < 1), indicating the least irreversible loss of available energy for the thermal gain achieved.
  • Material Limitation & 6CCVD Value: The study utilized 6063 Aluminum (Thermal Conductivity: 218 W/m¡K). 6CCVD’s Single Crystal Diamond (SCD) or high-purity Polycrystalline Diamond (PCD) offers thermal conductivity up to 10 times greater, providing a direct pathway to replicate or exceed these performance gains in ultra-high-power density systems.
ParameterValueUnitContext
Heat Source Power (Q)1451WSteady and uniform heat flow delivered
Heat Source Area235 x 74mmArea of constant heat flow density
Reynolds Number Range (Re)10,000 - 60,000DimensionlessTurbulent flow regime investigated
Coolant Inlet Temperature (Tf,in)25°CConstant boundary condition (Water)
Heat Sink Material (Paper)6063 Al AlloyN/AThermal Conductivity: 218 W/m¡K
Optimal Rib ConfigurationFC-ERN/AElliptic Ribs (Best PEC and Ns)
FC-ER Nu Improvement15.80% to 30.77%PercentageCompared to Smooth Flow Channel (SFC)
FC-ER Maximum Temperature (Re=20,000)47.51°CLowest maximum surface temperature observed
Maximum Model Deviation< 10%Validation of Nusselt number and pressure drop
Rib Height (Hrib)5mmFixed dimension
Channel Height (Hc)10mmFixed dimension
Rib Spacing40mmFixed dimension

The research employed a validated numerical simulation approach based on computational fluid dynamics (CFD) coupled with experimental verification.

  1. Physical Model: A liquid-cooled heat sink featuring a double-helical-type channel structure and a cover plate reinforced with five distinct rib configurations (FC-DR, FC-RR, FC-DSR, FC-ER, FC-FR).
  2. Governing Equations: Continuity, Momentum, and Energy equations were solved assuming incompressible Newtonian fluid flow, constant material properties, and adiabatic external surfaces.
  3. Flow Regime: Simulations were conducted under turbulent flow conditions across a Reynolds number range of 10,000 to 60,000.
  4. Numerical Solution: The SIMPLE method was utilized to connect pressure and velocity, with residual criteria set at 10-3 for flow and 10-7 for energy.
  5. Validation: The numerical model was validated against experimental data obtained from the diamond-shaped rib configuration (FC-DR), confirming maximum deviations for Nusselt number and pressure drop were controlled within 10%.
  6. Performance Assessment: Comprehensive performance was evaluated using the Performance Evaluation Criteria (PEC) and the Augmentation Entropy-Generation Number (Ns), which assesses irreversible losses based on the second law of thermodynamics.

The research successfully demonstrated significant thermal enhancement through geometric optimization of the heat sink structure. However, the performance ceiling is fundamentally limited by the thermal conductivity of the 6063 Aluminum alloy used (218 W/m¡K). 6CCVD specializes in MPCVD diamond, offering thermal conductivities up to 10 times higher, providing the necessary material foundation to achieve next-generation thermal management performance for ultra-high-power density applications (e.g., GaN/SiC power electronics, high-flux laser systems).

To replicate and significantly extend the performance demonstrated in this research, 6CCVD recommends the following materials:

Application Requirement6CCVD Material RecommendationThermal Conductivity (Typical)
Ultra-High Performance Substrate (Maximum heat spreading)Optical Grade Single Crystal Diamond (SCD)1800 - 2000 W/m¡K
Large Area Heat Spreader/Cover (Scaling up to inch-size modules)High-Purity Polycrystalline Diamond (PCD)1000 - 1800 W/m¡K
Electrochemically Active Heat Sink (If BDD is required for direct fluid contact/sensing)Boron-Doped Diamond (BDD)500 - 1000 W/m¡K

6CCVD’s advanced MPCVD growth and fabrication capabilities are perfectly suited to meet the complex geometric and integration requirements of this optimized heat sink design (FC-ER).

  • Custom Dimensions: We supply plates and wafers up to 125 mm (PCD) and custom substrates up to 10 mm thick, easily accommodating the required 235 x 74 mm heat source area and channel dimensions (30 mm width, 10 mm height).
  • Precision Micro-Machining: 6CCVD offers high-precision laser cutting and etching services necessary to fabricate the complex double-helical channels and the optimized elliptic rib structures (FC-ER) directly into the diamond material.
  • Surface Finish: To minimize the friction factor (f) and flow entropy generation (SΔP)—critical factors in the study—we provide ultra-smooth polishing:
    • SCD: Surface roughness Ra < 1 nm.
    • Inch-size PCD: Surface roughness Ra < 5 nm.
  • Integration & Metalization: We offer in-house metalization services (Au, Pt, Pd, Ti, W, Cu) for robust electrical and thermal interfaces, allowing seamless integration of the diamond heat sink with high-power semiconductor devices (e.g., direct die attach).

6CCVD’s in-house team of PhD material scientists and thermal engineers can assist researchers and design teams in transitioning from metallic heat sinks to diamond solutions for similar liquid-cooled micro-channel heat sink projects. We provide consultation on material selection, optimal thickness determination (SCD vs. PCD), and custom fabrication specifications to ensure maximum thermal efficiency and reliability.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Heat-transfer enhancement and entropy generation were investigated for a double-helical-type-channel heat sink with different rib structures set on the upper wall. Based on available experimental data, a series of simulations with various turbulence models were conducted to find the best numerical model. Five different rib structures were considered, which were diamond (FC-DR), rectangular (FC-RR), drop-shaped (FC-DSR), elliptic (FC-ER) and frustum (FC-FR). The research was carried out under turbulent flow circumstances with a Reynolds number range of 10,000-60,000 and a constant heat-flow density. The numerical results show that the thermal performance of the flow channel set with a rib structure is better than that of the smooth channel. FC-ER offers the lowest average temperature and the highest temperature uniformity, with a Nusselt number improvement percentage ranging from 15.80% to 30.77%. Overall, FC-ER shows the most excellent performance evaluation criteria and lowest augmentation entropy-generation number compared with the other reinforced flow channels.

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