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Surface Transfer Doping in MoO3–x/Hydrogenated Diamond Heterostructure

MetadataDetails
Publication Date2024-02-01
JournalThe Journal of Physical Chemistry Letters
AuthorsLiqiu Yang, Ken‐ichi Nomura, Aravind Krishnamoorthy, Thomas Linker, Rajiv K. Kalia
InstitutionsUniversity of Southern California, Texas A&M University
Citations1
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Technical Documentation & Analysis: Surface Transfer Doping in MoO3-x/Hydrogenated Diamond Heterostructure

Section titled “Technical Documentation & Analysis: Surface Transfer Doping in MoO3-x/Hydrogenated Diamond Heterostructure”

6CCVD Reference Document: 6CCVD-TD-2024-001 Source Paper: J. Phys. Chem. Lett. 2024, 15, 1579-1583


This research provides critical theoretical validation for utilizing Molybdenum Oxide (MoO3-x) in Surface Transfer Doping (STD) of hydrogen-terminated diamond, a key technology for next-generation high-power and high-frequency Field-Effect Transistors (FETs).

  • Core Value Proposition: MoO3-x is confirmed as a highly effective surface electron acceptor for H-terminated diamond, successfully generating a quasi-two-dimensional subsurface hole gas (2DHG).
  • Material Requirement: The mechanism relies on the intrinsic properties of high-quality Single Crystal Diamond (SCD) substrates, specifically requiring the (111) orientation for optimal H-termination and interface formation.
  • Performance Driver: The spatially extended nature of the doped holes observed in the simulations is consistent with the excellent transport properties necessary for high-performance FETs.
  • Engineering Guidance: Charge transfer efficiency is found to monotonically decrease as the oxygen vacancy level ($x$) increases (i.e., higher Mo oxidation state yields superior doping), providing a clear pathway for dopant material optimization.
  • Methodology: The study employed advanced first-principles-informed Reactive Molecular Dynamics (RMD) and Density Functional Theory (DFT) simulations to elucidate the atomistic and electronic charge transfer mechanisms at the interface.
  • 6CCVD Relevance: Replication and experimental validation of this work require ultra-high purity, low-defect SCD substrates with precise (111) orientation, a core offering of 6CCVD’s MPCVD capabilities.

The following hard data points, extracted from the analysis, define the performance potential and material requirements for diamond-based high-power electronics utilizing STD.

ParameterValueUnitContext
Diamond Bandgap5.5eVWide bandgap semiconductor
Electron Mobility (Bulk)4,500cm2/V sHigh carrier mobility of SCD
Hole Mobility (Bulk)3,800cm2/V sHigh carrier mobility of SCD
Breakdown Electric Field> 10MV/cmKey for high-power applications
Thermal Conductivity22W cm-1 K-1Essential for high-power device cooling
Optimal MoO3-x Vacancy Level ($x$)0.1N/ALowest vacancy level yields highest charge transfer (2.0 electrons)
Fermi Level Shift (EF - VBM)-0.19eVHighest energy range of doped holes (for $x=0.1$)
RMD Melting Temperature3,300KTemperature used to thermalize MoO3-x oxides
DFT Plane Wave Cutoff450eVParameter for VASP calculations

The theoretical study relied on a rigorous three-step simulation workflow combining classical and quantum methods to accurately model the complex diamond-oxide interface.

  1. Reactive Molecular Dynamics (RMD) Simulation:
    • Used ReaxFF interatomic potential to model the deposition of MoO3-x onto the H-terminated diamond (111) surface.
    • MoO3-x was gradually heated and melted at 3,300 K using RXMD software to generate amorphous oxide structures prior to deposition.
  2. Quantum Molecular Dynamics (QMD) Optimization:
    • The RMD-generated interfacial structure was further optimized using DFT-based QMD (VASP software).
    • Employed the Projector-Augmented Wave (PAW) method and the PBE Generalized Gradient Approximation (GGA) functional.
    • A plane wave cutoff of 450 eV was applied.
  3. Electronic Structure Computation:
    • DFT calculations were performed on the final equilibrated structure to determine electronic density-of-states (DOS) alignment and quantitative Bader charge transfer.
    • A fine 3x3x1 Monkhorst-Pack k-point mesh was used for high-accuracy electronic structure analysis.

The successful experimental realization and scaling of diamond FETs based on MoO3-x Surface Transfer Doping depend entirely on the quality and customization of the underlying diamond substrate. 6CCVD is uniquely positioned to supply the necessary materials and engineering services.

To replicate or extend this research into functional devices, researchers require the highest quality Single Crystal Diamond (SCD) substrates.

Material Specification6CCVD OfferingRelevance to STD Research
SCD Substrate OrientationPrecise (111) orientationRequired for optimal and stable H-termination, which facilitates electron transfer and 2DHG formation.
SCD Purity & QualityOptical Grade SCDUltra-low defect density is critical to achieve the high carrier mobility (4,500 cm2/V s) cited in the paper.
Surface FinishPolishing to Ra < 1nmEssential for minimizing interface scattering and ensuring uniform deposition of the MoO3-x layer.
H-Termination ReadinessAs-grown or polished SCDProvides the necessary foundation for subsequent plasma-enhanced chemical vapor deposition (PECVD) or thermal hydrogenation processes.

Customization Potential for Device Fabrication

Section titled “Customization Potential for Device Fabrication”

While the paper focuses on the doping mechanism, device integration requires specific dimensions and electrical contacts. 6CCVD offers full customization capabilities to transition from simulation to prototype.

  • Custom Dimensions: We provide SCD plates in standard sizes and custom dimensions, with capabilities for Polycrystalline Diamond (PCD) wafers up to 125mm for scaling studies.
  • Thickness Control: SCD layers can be grown from 0.1µm up to 500µm, allowing researchers to optimize thermal management and device architecture.
  • Advanced Metalization: Device integration requires robust ohmic contacts. 6CCVD offers in-house deposition of critical metal stacks (e.g., Ti/Pt/Au, W, Cu) necessary for high-temperature, high-power diamond FET contacts.
  • Laser Cutting and Shaping: We provide precision laser cutting services to achieve unique geometries and electrode patterns required for experimental FET layouts.

6CCVD’s in-house PhD team specializes in MPCVD growth optimization and material selection for advanced electronic and quantum applications. We can assist researchers and engineers with:

  • Material Selection: Consulting on the optimal SCD grade, orientation, and thickness required for specific Surface Transfer Doping (STD) projects.
  • Interface Preparation: Guidance on achieving the necessary surface termination (H-termination) and surface roughness (Ra < 1nm) to maximize 2DHG conductivity and stability.
  • Global Logistics: We offer reliable global shipping (DDU default, DDP available) to ensure materials arrive safely and promptly for time-sensitive research.

For custom specifications or material consultation regarding high-power diamond FETs or similar Surface Transfer Doping projects, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Surface transfer doping is proposed to be a potential solution for doping diamond, which is hard to dope for applications in high-power electronics. While MoO<sub>3</sub> is found to be an effective surface electron acceptor for hydrogen-terminated diamond with a negative electron affinity, the effects of commonly existing oxygen vacancies remain elusive. We have performed reactive molecular dynamics simulations to study the deposition of MoO<sub>3-<i>x</i></sub> on a hydrogenated diamond (111) surface and used first-principles calculations based on density functional theory to investigate the electronic structures and charge transfer mechanisms. We find that MoO<sub>3-<i>x</i></sub> is an effective surface electron acceptor and the spatial extent of doped holes in hydrogenated diamond is extended, promoting excellent transport properties. Charge transfer is found to monotonically decrease with the level of oxygen vacancy, providing guidance for engineering of the surface transfer doping process.