Influence of cutting parameters on wear of diamond wire during multi-wire rocking sawing with reciprocating motion

At a Glance

Metadata	Details
Publication Date	2022-08-30
Journal	Frontiers in Mechanical Engineering
Authors	Zixing Yang, Hui Huang, Xinjiang Liao
Institutions	Huaqiao University
Citations	4
Analysis	Full AI Review Included

Technical Documentation & Analysis: Diamond Wire Saw Wear Modeling

Executive Summary

This analysis of the multi-wire rocking sawing wear model confirms that precise control over diamond material properties is paramount for high-throughput slicing of hard-and-brittle materials (SiC, Sapphire). 6CCVD provides the advanced MPCVD diamond solutions necessary to mitigate the wear effects identified in this research.

Core Challenge: Wear of diamond wire saws significantly impacts cut quality and tool life, particularly when slicing materials like SiC and Sapphire.
Key Finding: Workpiece feed speed ($v_s$) and wire setting out length ($L$) are the dominant factors influencing maximum wire wear. Maximum rocking angle ($\theta$), wire speed ($v_w$), and reciprocating times ($f$) have minimal impact.
Material Demand: The uneven wear observed, especially during circular ingot slicing, necessitates diamond material with exceptional uniformity and abrasive resistance.
6CCVD Solution: We supply high-purity Single Crystal Diamond (SCD) and Polycrystalline Diamond (PCD) wafers/plates, offering superior hardness and thermal stability for manufacturing high-performance diamond wire dies and critical machine components.
Customization Advantage: 6CCVD offers custom dimensions (up to 125mm PCD) and ultra-low roughness polishing (Ra < 1nm for SCD) to minimize friction and maximize the longevity of diamond components used in advanced wire sawing equipment.
Engineering Support: Our in-house PhD team specializes in optimizing diamond material selection for extreme abrasive environments, ensuring maximum efficiency in multi-wire slicing applications.

Technical Specifications

The following hard data points were extracted from the numerical simulation parameters and results, highlighting the operational envelope studied for diamond wire wear.

Parameter	Value	Unit	Context
Maximum Wire Speed ($v_w$) Range	10 to 30	m/s	Simulation variable
Workpiece Feed Speed ($v_s$) Range	0.1 to 0.3	m/min	Dominant wear factor
Setting Out Length ($L$) Range	8 to 24	m/min	Dominant wear factor
Maximum Rocking Angle ($\theta$) Range	2 to 10	°	Minimal wear factor
Reciprocating Times ($f$) Range	0.4 to 1.2	min^-1	Minimal wear factor
Rectangular Workpiece Size	0.2 x 0.2	m	Standard simulation size
Round Workpiece Radius ($R$)	0.1	m	Standard simulation size
Number of Cut Pieces	100	pieces	Standard simulation batch size
Highest Max Wear (Rectangular, $L=8$)	12.519 x 10^-8	m³	Observed maximum wear (Figure 9B)
Highest Max Wear (Rectangular, $v_s=0.3$)	9.389 x 10^-8	m³	Observed maximum wear (Figure 9D)

Key Methodologies

The research utilized a theoretical wear model based on the correlation between the volume of workpiece removed and the wire saw wear degree ($S = p \cdot k$). The study employed numerical simulation using single-factor experiments to analyze the influence of five key cutting parameters.

Wear Model Establishment: A theoretical wire saw wear model was established by correlating the volume of the workpiece removed per unit wire saw length to the wire saw wear degree ($S$).
Iteration Method: The total wear was calculated by superimposing the wear caused by cutting every monolithic wafer, using an iterative matrix addition process (multiS_location).
Workpiece Geometry: Simulations were conducted using two primary geometries:
- Rectangular workpieces (showing stable wear in the middle section).
- Circular workpieces (showing highly uneven wear throughout the process).
Reciprocating Motion Analysis: The model incorporated the complex speed changes during the reciprocating cycle, including acceleration ($t_a$), uniform forward motion ($t_f$), and uniform backward motion ($t_b$).
Single-Factor Simulation: Five key parameters ($\theta$, $v_w$, $v_s$, $L$, $f$) were varied individually across defined ranges to isolate their influence on maximum wire wear ($S/k$).

6CCVD Solutions & Capabilities

The findings underscore the critical need for diamond materials that can withstand high abrasive wear and maintain structural integrity under varying load conditions, especially when slicing high-value materials like SiC and Sapphire. 6CCVD is uniquely positioned to supply the foundational diamond components required for next-generation multi-wire sawing technology.

Applicable Materials

To replicate or extend this research, particularly in developing ultra-durable diamond wire dies or machine components that guide the wire web, 6CCVD recommends the following materials:

6CCVD Material	Recommended Application	Rationale
High-Purity PCD	Wire Drawing Dies, Wire Guides, Large-Area Machine Components	Exceptional toughness and wear resistance for high-volume, large-area abrasive contact. Available up to 125mm diameter.
Optical Grade SCD	Precision Wire Dies, Sensor Substrates, Calibration Standards	Highest purity and uniformity (Ra < 1nm achievable). Ideal for minimizing friction and ensuring maximum dimensional stability in critical areas.
Boron-Doped Diamond (BDD)	Integrated Sensors (Thermal/Electrochemical)	Can be integrated into the sawing machine structure to monitor localized temperature or wear (P_location) in real-time, correlating directly with the wear model parameters.

Customization Potential

The research highlights that wear is highly dependent on the contact area and friction characteristics. 6CCVD’s customization capabilities directly address these challenges:

Custom Dimensions: We provide PCD and SCD plates/wafers up to 125mm diameter, allowing manufacturers to create larger, more robust wire guides or dies than typically available.
Ultra-Low Roughness Polishing: Achieving Ra < 1nm (SCD) and Ra < 5nm (Inch-size PCD) is crucial. Lower surface roughness on diamond guides minimizes friction, reducing the mechanical stress and thermal load on the diamond wire itself, thereby extending tool life and improving wafer surface quality.
Metalization Services: 6CCVD offers in-house metalization (Au, Pt, Pd, Ti, W, Cu). This is essential for integrating diamond components (e.g., SCD heat sinks or BDD sensors) into the sawing machine structure for advanced thermal management or electronic monitoring of wear parameters.

Engineering Support

The complexity of the multi-wire wear model, which involves iterative matrix superposition and analysis of five distinct cutting parameters, requires deep material science expertise.

Application Expertise: 6CCVD’s in-house PhD team specializes in the mechanical and thermal properties of MPCVD diamond under extreme conditions. We offer consultation to optimize material selection for projects focused on minimizing wear in SiC and Sapphire slicing applications.
Global Supply Chain: We ensure reliable, global delivery of custom diamond materials (DDU default, DDP available) to support continuous R&D and high-volume manufacturing worldwide.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Multi-wire cutting with diamond wire saw has gradually become the main processing method for hard-and-brittle materials due to its small kerf loss and high machining accuracy. However, the diamond wire saw will inevitably suffer wear during the process of machining, and hence affects the quality of the cut surface. In this paper, a wire saw wear model was established, and the wear at different positions on the wire saw was theoretically calculated by correlating the volume of the workpiece removed by the unit wire saw to the wire saw wear. The iteration method was used to calculate the wear of the wire saw after cutting by superimposing the wear caused by every monolithic wafer. Based on this wear year model of the wire saw, the influence of multi-wire cutting parameters and the shapes of the workpiece on the wire saw wear was discussed through numerical simulation. The simulation results showed that the feed speed of the workpiece and the length of the wire saw had an obvious effect on the maximum wear of the wire saw, and the maximum rocking angle, wire speed, and reciprocating times had little effect on the maximum wear of the wire saw. The wear curve of the circular workpiece wire saw is unstable in the whole process, and the wear curve of the rectangular workpiece wire saw changes at the beginning and end, and the middle is stable.

Tech Support

Original Source

DOI: https://doi.org/10.3389/fmech.2022.978714

References

2019 - MACE nano-texture process applicable for both single- and multi-crystalline diamond-wire sawn Si solar cells [Crossref]
2016 - Experiment study on electroplated diamond wire saw slicing single-crystal silicon [Crossref]
2016 - Theoretical research on contact length in the rocking motion wire saw [Crossref]
2015 - Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw [Crossref]
2013 - Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires [Crossref]
2018 - Investigation of the progressive wear of individual diamond grains in wire used to cut monocrystalline silicon [Crossref]
2016 - Effect of wear of diamond wire on surface morphology, roughness and subsurface damage of silicon wafers [Crossref]
2016 - Investigation on diamond wire break-in and its effects on cutting performance in multi-wire sawing [Crossref]
2015 - Slicing parameters optimizing and experiments based on constant wire wear loss model in multi-wire saw [Crossref]
2022 - Experimental investigation on diamond wire sawing of Si3N4 ceramics considering the evolution of wire cutting performance [Crossref]