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Investigation of Surface Acoustic Wave Propagation Characteristics in New Multilayer Structure - SiO2/IDT/LiNbO3/Diamond/Si

MetadataDetails
Publication Date2021-10-21
JournalMicromachines
AuthorsHanqiang Zhang, Hongliang Wang
InstitutionsNorth University of China
Citations28
AnalysisFull AI Review Included

Technical Documentation & Analysis: High-Performance SAW Filters using CVD Diamond Substrates

Section titled “Technical Documentation & Analysis: High-Performance SAW Filters using CVD Diamond Substrates”

This document analyzes the research paper “Investigation of Surface Acoustic Wave Propagation Characteristics in New Multilayer Structure: SiO2/IDT/LiNbO3/Diamond/Si” to provide technical specifications and highlight how 6CCVD’s advanced CVD diamond materials and processing capabilities are essential for replicating and advancing this high-frequency Surface Acoustic Wave (SAW) technology.


The research successfully models a novel multilayer structure utilizing diamond as a high-velocity substrate for next-generation SAW filters, achieving superior performance metrics critical for 5G and beyond.

  • High Phase Velocity: The diamond layer enabled a high phase velocity (Vp) up to 10 km/s (Sezawa mode), significantly increasing the potential operating frequency (f0 > 1 GHz, with potential for >10 GHz).
  • Zero TCF Achieved: The inclusion of the SiO2 temperature compensation layer resulted in an optimal Temperature Coefficient of Frequency (TCF) of 0 ppm/°C, solving the poor temperature stability issues common in LiNbO3-based devices.
  • Enhanced Coupling: A high electromechanical coupling coefficient (k2) of up to 6.47% was achieved, crucial for wideband applications.
  • Material Advantage: Diamond’s high elastic modulus (1200 GPa) and excellent thermal conductivity allow the device to handle super-high power at high frequencies, surpassing traditional SAW materials.
  • Process Simplification: The high phase velocity provided by the diamond substrate allows for a larger interdigital transducer (IDT) finger width (λ = 6 ”m used), reducing photolithography difficulty and ohmic loss compared to traditional high-frequency designs.

The following parameters were extracted from the finite element method (FEM) simulation results for the optimized SiO2/IDT/LiNbO3/Diamond/Si structure.

ParameterValueUnitContext
Maximum Phase Velocity (Vp)10km/sSezawa mode, h1/a = 0.1
Maximum Coupling Coefficient (k2)6.47%Sezawa mode, h1/a = 0.4, h5/a = 0.2
Optimal TCF0ppm/°CZero temperature coefficient achieved
Center Frequency (f0)1023MHzSimulated operating frequency
Potential Frequency (f0)>10GHzPredicted for λ = 1 ”m (Sezawa mode)
SAW Wavelength (λ)6”mDesigned parameter for simulation
Diamond Elastic Modulus (E)1200GPaKey material property for high Vp
Diamond Density (ρ)3515Kg/m3Material constant used in simulation
LiNbO3 TCF (Bulk Crystal)-75ppm/°CImproved significantly by multilayer structure

The investigation relied on advanced simulation techniques to optimize the layered structure for high-performance SAW devices.

  1. Finite Element Method (FEM) Simulation: COMSOL Multiphysics 5.6 was utilized to model the piezoelectric coupling between the structural domain (stress, strain) and the electrical domain (electric field, displacement).
  2. Multilayer Structure Defined: The model analyzed a SiO2/IDT/128°YX-LiNbO3/Diamond/Si stack, focusing on the interaction between the high-velocity diamond substrate and the piezoelectric LiNbO3 film.
  3. Geometric Parameter Optimization: A 2D unit model was established with a fixed SAW wavelength (λ = 6 ”m) and metallization rate (MR = 0.5).
  4. Thickness Ratio Variation: The normalized film thickness ratios (h1/a for LiNbO3, h4/a for IDT metal, and h5/a for SiO2) were systematically varied to determine optimal Vp, k2, and TCF.
  5. Transient Analysis: Time-domain simulation (50 ns run time) was performed to analyze the propagation state of the acoustic signal and validate the confinement of acoustic energy near the surface, which improves the Q-factor.

6CCVD is uniquely positioned to supply the high-quality CVD diamond materials required to transition this theoretical design into manufacturable, high-performance SAW filters. Our capabilities meet and exceed the stringent material requirements for high-frequency acoustic devices.

The core of this high-performance structure is the diamond layer, which requires exceptional purity, stiffness, and thermal properties. 6CCVD recommends the following materials:

  • Optical Grade Polycrystalline Diamond (PCD): Ideal for large-area, cost-effective substrates. Our PCD wafers offer high stiffness and thermal conductivity, crucial for high-power SAW applications. Available in custom dimensions up to 125mm.
  • High-Quality Single Crystal Diamond (SCD): For ultimate performance, especially in high-frequency applications where minimal scattering is required. SCD offers superior crystalline quality and uniformity, ensuring optimal acoustic wave propagation.
  • Custom Substrate Thickness: 6CCVD can supply diamond films (SCD/PCD) in the required thickness range (0.1 ”m to 500 ”m) or as robust substrates up to 10 mm thick, suitable for integration with the LiNbO3/Si stack.

The fabrication of the SiO2/IDT/LiNbO3/Diamond/Si structure requires precise material deposition and patterning, all of which 6CCVD supports.

Requirement from Paper6CCVD Customization CapabilityValue Proposition
Diamond SubstrateCustom dimensions up to 125mm (PCD) and precise thickness control (0.1 ”m - 500 ”m).Enables scaling from R&D prototypes to commercial wafer sizes.
IDT MetalizationCustom metal deposition services (Au, Pt, Pd, Ti, W, Cu).While the paper used Al, 6CCVD can deposit high-conductivity metals like Au or Pt for IDTs, minimizing ohmic loss and improving Q-factor.
Surface FinishUltra-low roughness polishing: Ra < 1 nm (SCD) and Ra < 5 nm (PCD).Essential for minimizing acoustic scattering losses and ensuring optimal coupling at GHz frequencies.
Integration SupportCustom laser cutting and shaping services.Allows for precise device geometry and integration into complex packaging.

The optimization of the multilayer structure (specifically the thickness ratios h1/a and h5/a) is critical to achieving the zero TCF and maximum k2.

6CCVD’s in-house PhD team specializes in CVD diamond material science and acoustic applications. We offer consultation services to assist engineers and scientists in:

  1. Material Selection: Determining the optimal diamond grade (SCD vs. PCD) and thickness for specific frequency and power handling requirements.
  2. Interface Engineering: Advising on surface preparation and polishing techniques necessary for high-quality deposition of the piezoelectric (LiNbO3) and compensation (SiO2) layers.
  3. Design Extension: Assisting with material specifications for similar high-frequency, wideband SAW filter projects, particularly those targeting the >10 GHz range predicted by the Sezawa mode analysis.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Surface acoustic wave (SAW) devices are widely used in many fields such as mobile communication, phased array radar, and wireless passive sensor systems. With the upgrade of mobile networks, the requirements for the performance of SAW devices have also increased, and high-frequency wideband SAW devices have become an important research topic in communication systems and other application fields. In this paper, a theoretical study for the realization of a layered SAW filter based on a new SiO2/IDT/128°YX-LiNbO3/diamond/silicon layered structure using the modeling software COMSOL Multiphysics is presented. The effects of lithium niobate (LiNbO3), an interdigital transducer (IDT), and SiO2 thin films on the evolution of the phase velocity, electromechanical coupling coefficient (k2), and temperature coefficient of frequency were studied by employing a finite element method simulation. Furthermore, a longitudinal coupling resonator filter was designed. To investigate the SAW characteristics of the filter, a transient analysis was conducted to calculate the electrical potential and particle displacement under the resonance condition and to analyze the frequency response. The study concluded that this new multilayer structure can be applied to design and manufacture a variety of high-frequency and wideband SAW filters with a temperature compensation function, for operation above the GHz range.

  1. 2020 - High-frequency surface acoustic wave resonator with ScAlN/hetero-epitaxial diamond [Crossref]
  2. 2021 - High-performance surface acoustic wave devices using composite substrate structures [Crossref]
  3. 2000 - Modelling of SAW filter based on ZnO/diamond/Si layered structure including velocity dispersion [Crossref]
  4. 2015 - FEM simulation of Rayleigh waves for SAW devices based on ZnO/AlN/Si [Crossref]
  5. 2017 - Enhanced performance of 17.7 GHz SAW devices based on AlN/diamond/Si layered structure with embedded nanotransducer [Crossref]
  6. 2020 - FEM analysis of piezoelectric film as IDT on the diamond substrate to enhance the quality factor of SAW devices [Crossref]
  7. 2013 - Characteristics of surface acoustic waves excited by (1120) zno films deposited on R-sapphire substrates [Crossref]
  8. 2020 - Analysis of propagation characteristics of AlN/diamond/Si layered SAW resonator [Crossref]
  9. 2007 - Theoretical investigation of surface acoustic wave in the new, three-layered structure: ZnO/AlN/diamond [Crossref]