Skip to content

Effects of the sequential implantation of Mg and N ions into GaN for p-type doping

MetadataDetails
Publication Date2021-09-29
JournalApplied Physics Express
AuthorsHideki Sakurai, Tetsuo Narita, Keita Kataoka, Kazufumi Hirukawa, Kensuke Sumida
InstitutionsUlvac-Phi (Japan), Polish Academy of Sciences
Citations32

The sequential implantation of Mg and N ions into GaN was investigated using conventional rapid thermal annealing and ultra-high-pressure annealing (UHPA). In cathodoluminescence, the green luminescence related to nitrogen vacancies (VNs) was mostly suppressed at the Mg/N ratio of 0.5-1.0, whereas the donor-acceptor pair (DAP) emission as a signature of Mg acceptors was maintained high. The excess N implantation reduced the DAP emission through the formation of nonradiative recombination centers. The combined process of optimal Mg/N implantation and UHPA at 1673 K improved ohmic contacts by increasing Mg concentration and suppressing VNs near the surface.