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The mechanics of sawing granite with diamond wire

MetadataDetails
Publication Date2021-07-10
JournalThe International Journal of Advanced Manufacturing Technology
AuthorsJanusz Konstanty
InstitutionsAGH University of Krakow
Citations17
AnalysisFull AI Review Included

Technical Documentation & Analysis: Diamond Wire Sawing Mechanics

Section titled ā€œTechnical Documentation & Analysis: Diamond Wire Sawing Mechanicsā€

This analysis of granite sawing mechanics provides critical insights into optimizing diamond tool performance in low-force, high-contact-length environments, directly informing the material specifications required for advanced Polycrystalline Diamond (PCD) tooling.

  • Low-Stress Environment: Diamond wire sawing (DWS) subjects diamond crystals to forces and pressures an order of magnitude lower than traditional circular sawing (CS).
  • Mild Cutting Conditions: The maximum chip thickness (hmax) in DWS is significantly smaller (0.13 µm) compared to CS (0.81 µm), indicating a mild abrasive environment.
  • Material Requirement Shift: Due to these mild conditions, the research concludes that more-irregular and friable diamond crystals are preferred over high-grade, blocky crystals to ensure better retention in the matrix and superior free-cutting action.
  • Wear Mitigation: Modeling identifies that eccentric and conical bead wear are primary failure modes, which must be addressed through optimized bead formulation and precise control of wire tension and down-feed rate (0.6-1.0 m²/h).
  • Tool Design Focus: The large difference in the length of contact (lc: 518 mm for DWS vs. 53.5 mm for CS) necessitates a fundamental divergence in diamond concentration and matrix design between the two sawing methods.
  • 6CCVD Value: 6CCVD specializes in providing the high-quality Polycrystalline Diamond (PCD) materials and custom metalization required to engineer next-generation abrasive beads that meet these specific low-force requirements.

Data extracted from the analysis of MDW sawing conditions for Class 1 granite.

ParameterValueUnitContext
Diamond Mesh Size40/50meshStandard for granite sawing
Diamond Concentration25N/AStandard (6.25% by volume)
Wire Linear Speed (vs)24 - 30m/sTypical operating range
MDW Cutting Rate0.6 - 1.0m²/hRecommended for multi-wire machines
Max Chip Thickness (hmax) - Wire Sawing0.13µmLow-stress cutting condition
Max Chip Thickness (hmax) - Circular Saw0.81µmHigh-stress cutting condition
Normal Force (FN) per Bead3.28NSawing Class 1 Granite (0.98 m²/h)
Friction Force (FF) per Bead0.35NSawing Class 1 Granite (0.98 m²/h)
Length of Contact (lc) - Wire Sawing518mmHigh contact length
Length of Contact (lc) - Circular Saw53.5mmLow contact length
Bead Diameter (db)6.3 - 11mmRange used in industry

The study employed a mechanistic approach supported by industrial data to model the forces and kinematics of diamond wire sawing.

  1. Mechanistic Modeling: A mathematical model was developed to analyze the dynamics of diamond wire sawing (DWS), contrasting it directly with established models for circular sawing (CS).
  2. Force Analysis: Calculation of the key forces acting on an individual diamond bead, including Normal Force (FN), Centrifugal Force (FC), and the weight of the wire (FG).
  3. Tension Increment Quantification: The increase in steel rope tension (ΔFT) across the cutting zone was calculated based on the friction force (FF) per bead, demonstrating that the total tension increase is minimal (approx. 1.5% of the pre-set value).
  4. Torque Balance Assessment: Analysis of the torque produced by friction (FF) relative to the torque provided by the tension force (FT) to determine conditions leading to bead rotation and subsequent unacceptable conical wear (ovalization).
  5. Chip Thickness Kinematics: Detailed comparison of the maximum (hmax) and average (havg) chip thickness between DWS and CS, highlighting the significantly milder penetration depth in wire sawing.
  6. Empirical Validation: Theoretical calculations were supported by industrial quantitative data, including measurements of wire tension, linear speed, down-feed rate, and net current consumption (I) used to estimate the maximum friction force (FF)max.

6CCVD provides the high-performance diamond materials and customization services necessary for engineers to replicate, optimize, and extend the findings of this research into superior abrasive tooling.

Research Requirement / Challenge6CCVD Applicable Materials & ServicesTechnical Sales Advantage
Material Optimization for Low Force: Need for irregular, friable diamond crystals and robust matrix retention (Conclusion 3).Polycrystalline Diamond (PCD) Plates/Wafers: We supply high-quality PCD materials, allowing R&D teams to test specific diamond grain sizes (e.g., 40/50 mesh equivalent) and morphologies optimized for low-force abrasive applications.Our PCD ensures superior diamond retention and controlled breakdown, preventing the progressive wear flatting observed when using high-grade, blocky crystals in mild cutting environments.
Custom Bead Prototyping: Need for precise bead dimensions (e.g., 8.1 mm diameter, 7 mm length) and segment testing.Custom Dimensions & Laser Cutting: 6CCVD fabricates PCD plates and wafers up to 125mm in diameter and custom thicknesses (0.1 µm - 500 µm). We offer precision laser cutting services to create custom segment geometries for bead prototyping.Enables rapid iteration on bead geometry (db and lb) to optimize the torque balance equation (db/2 * FF = r * FT) and effectively mitigate conical wear.
Enhanced Matrix Bonding: Requirement for strong chemical bonding between diamond and the sintered metal matrix (e.g., Co/Fe/Cu).Advanced Metalization Services: We offer in-house metalization capabilities (Ti, W, Cu, Pt, Pd, Au) crucial for creating strong chemical interfaces between the diamond surface and the surrounding metallic bond.Improves the thermal stability and mechanical retention of the diamond crystals within the sintered bead, reducing the incidence of pullouts and prolonging tool life.
Engineering Support for Abrasive Tooling: Need for expertise in material selection for specific abrasive applications (e.g., granite sawing).In-House PhD Engineering Team: 6CCVD provides consultation on material selection, focusing on optimizing diamond concentration, morphology, and matrix compatibility for specific abrasive tooling projects.Leverage our expertise in MPCVD diamond synthesis to ensure the chosen PCD material maximizes productivity (m²/h) while minimizing common failures like eccentric wear and wire breakage.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Abstract Today, wire sawing of natural stone is undergoing widespread commercialization. In addition to rock extraction and processing with single wires, composed of a multitude of diamond-impregnated beads mounted onto a steel rope, this technology is increasingly used for slabbing of granite blocks on multi-wire machines. Evolving sophistication of stone sawing equipment dictates novel tool designs and formulations. For technologists specifying bead compositions, it is a common habit to instinctively follow the circular saw segment design guidelines. A poor tool performance is often an undesirable consequence of such an approach. To meet that challenge, theoretical models of sawing granite by means of a diamond wire saw and a diamond circular saw have been presented and contrasted with respect to diamond loading conditions. The analytical treatments are supported by scarcely available industrial quantitative assessments and qualitative observations. The evaluation of cutting forces and the identification of system characteristics affecting wire vibration and wire rotation are instrumental in both machine design and tool formulation. For practitioners working with granite, the provided knowledge is also essential to diagnose and prevent problems inherent in wire sawing, such as the high incidence of wire breakage, unsatisfactory tool life and cutting capability and eccentric bead wear. Graphical abstract

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