Diamond Microstructuring by Deep Anisotropic Reactive Ion Etching
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2018-07-25 |
| Journal | physica status solidi (a) |
| Authors | Š. Š. ŠŠ¾Š»Š¾Š²Š°Š½Š¾Š², Š. Š”. ŠŠ¾ŃŠ¼Š°ŃŠ¾Š², Nikolay V. Luparev, Š”. Š. Š¢Š°ŃŠµŠ»ŠŗŠøŠ½, S. Yu. Troschiev |
| Institutions | National University of Science and Technology, Technological Institute for Superhard and Novel Carbon Materials |
| Citations | 22 |
Abstract
Section titled āAbstractāFabrication of diamond microāpatterned structures is a technological challenge due to the outstanding hardness and chemical stability of the material. In this work, the synthetic diamond reactive ion etching (RIE) process is studied. The effects of the gas mixture and bias on the diamond etching rate are investigated. A high etching rate (up to 5 Ī¼m h ā1 ) is achieved in SF 6 based plasmas with the intensive ion sputtering. The features of protective masks on diamond samples fabrication are discussed. Etching selectivities of Al, Ni, Mo, Al 2 O 3 , and AlN as mask materials in SF 6 plasma are investigated. The initial size of the mask affects its selectivity. To explain the influence of the initial mask shape on the selectivity, a semiāempirical model of the diamondāmask topography transformation under the ion sputtering is proposed. By setting the shape of the masks, it is possible to form diamond structures with any desirable profile using the same etching process: steep walls with 20 Ī¼m height, solid immersion lenses with 2-10 Ī¼m radii, conic figures, and developed surface. This is a relatively simple and universal method of diamond microstructures fabrication.