Formation of Cu Nanodots on Diamond Surface to Improve Heat Transfer in Cu/D Composites
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2017-12-18 |
| Journal | Advanced Engineering Materials |
| Authors | Thomas Guillemet, JeanāMarc Heintz, B. Mortaigne, Yongfeng Lu, JeanāFranƧois Silvain |
| Institutions | Institut de Chimie de la MatiĆØre CondensĆ©e de Bordeaux, University of NebraskaāLincoln |
| Citations | 9 |
Abstract
Section titled āAbstractāDiamondādispersed copper matrix (Cu/D) composite materials with different interfacial configurations are fabricated through powder metallurgy and their thermal performances are evaluated. An innovative solution to chemically bond copper (Cu) to diamond (D) has been investigated and compared to the traditional Cu/D bonding process involving carbideāforming additives such as boron (B) or chromium (Cr). The proposed solution consists of coating diamond reinforcements with Cu particles through a gas-solid nucleation and growth process. The Cu particleācoating acts as a chemical bonding agent at the Cu-D interface during hot pressing, leading to cohesive and thermally conductive Cu/D composites with no carbideāforming additives. Investigation of the microstructure of the Cu/D materials through scanning electron microscopy, transmission electron microscopy, and atomic force microscopy analyses is coupled with thermal performance evaluations through thermal diffusivity, dilatometry, and thermal cycling. Cu/D composites fabricated with 40 vol% of Cuācoated diamonds exhibit a thermal conductivity of 475 W m ā1 K ā1 and a thermal expansion coefficient of 12 Ć 10 ā6 Ā°C ā1 . These promising thermal performances are superior to that of Bācarbideābonded Cu/D composites and similar to that of Crācarbideābonded Cu/D composites fabricated in this study. Moreover, the Cu/D composites fabricated with Cuācoated diamonds exhibit higher thermal cycling resistance than carbideābonded materials, which are affected by the brittleness of the carbide interphase upon repeated heating and cooling cycles. The asādeveloped materials can be applicable as heat spreaders for thermal management of power electronic packages. The copperācarbon chemical bonding solution proposed in this article may also be found interesting to other areas of electronic packaging, such as brazing solders, direct bonded copper substrates, and polymer coatings.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- 2002 - Diamond Films Handbook [Crossref]