Cutting with diamond saw blades non-metallic materials

At a Glance

Metadata	Details
Publication Date	2017-04-01
Journal	Mechanik
Authors	Bożena Ciałkowska, Magdalena Wiśniewska
Institutions	Wrocław University of Science and Technology
Analysis	Full AI Review Included

Technical Documentation & Analysis: Precision Cutting of Hard Non-Metallic Materials

Executive Summary

This analysis reviews the application of diamond saw blades for cutting hard, non-metallic materials, focusing on the high-precision requirements relevant to semiconductor and optical engineering.

Core Application: Diamond saws are essential for processing hard-to-machine materials, including natural stones, ceramics, and critical monocrystals (e.g., Silicon, Quartz, Sapphire).
Precision Requirement: Internal Diameter (ID) diamond saws are utilized for high-precision applications (e.g., wafer slicing), specifically to minimize material loss (kerf width) and surface damage (damage zone/roughness).
Performance Metrics: ID saws achieve extremely narrow kerf widths (0.1-0.3 mm) and superior surface roughness (Ra around 0.1 µm) compared to External Diameter (OD) saws.
Material Quality Criticality: The high cost and demanding specifications of materials like SCD (Single Crystal Diamond) and high-purity PCD (Polycrystalline Diamond) necessitate the use of these advanced, low-loss cutting techniques.
6CCVD Value Proposition: 6CCVD supplies the high-quality, large-area SCD and PCD plates and wafers that are the subject of this precision slicing, ensuring optimal material properties prior to processing.
Processing Challenge: Maintaining blade stiffness (0.1-0.2 mm thickness) through radial tensioning and ensuring rigid workpiece mounting are critical to achieving the required dimensional accuracy and surface integrity.

Technical Specifications

The following data points summarize the performance characteristics of diamond saw blades, particularly highlighting the differences between high-precision Internal Diameter (ID) cutting and general External Diameter (OD) cutting.

Parameter	Value	Unit	Context
ID Saw Blade Thickness	0.1 - 0.2	mm	Low thickness requires radial tensioning for stiffness
ID Saw Kerf Width (T)	0.1 - 0.3	mm	Minimal material loss for monocrystal slicing (Fig 4b)
OD Saw Kerf Width (T)	0.1 - 3	mm	General purpose cutting (Fig 4a)
ID Saw Surface Roughness (Ra)	~0.1	µm	Achievable roughness on cut surface (high precision)
OD Saw Surface Roughness (Ra)	Several	µm	Typical roughness for external diameter blades
ID Saw Cutting Speed (Vf)	16 - 20	m/s	Typical range for internal diameter blades
OD Saw Cutting Speed (Vf)	> 40	m/s	Significantly higher speed for general cutting
Target Materials for ID Cutting	Si, Quartz, Sapphire, Ceramics	N/A	Materials requiring minimal damage zone and high dimensional accuracy

Key Methodologies

The research details the manufacturing and operational requirements for high-performance diamond cutting tools, emphasizing techniques necessary for processing hard monocrystalline materials.

Diamond Tool Fabrication: The process involves preparing and mixing raw materials (diamond grains and metal powder), followed by cold or hot pressing, sintering, and finally joining the diamond segments or continuous rim to the metal core.
Matrix Composition: Powder metallurgy is typically employed, utilizing Cobalt (Co) or alloys of Co with Iron (Fe), Copper (Cu), Bronze, or Nickel (Ni) as the binding matrix for the diamond abrasive.
Abrasive Layer Application: The diamond layer can be applied continuously (continuous rim) or segmented. For ID saws, a multi-layer electroplated coating of micro-diamond grains is often used on the inner circumference.
ID Saw Tensioning: Due to the extremely thin profile (0.1-0.2 mm), ID blades must be radially tensioned using perimeter mounting holes to achieve sufficient stiffness, preventing deflection and runout during high-speed cutting.
Process Environment: High-precision cutting, especially with ID saws, requires wet processing (lubrication/cooling) to manage thermal effects, prevent weakening of the blade joint, and ensure efficient chip removal.
Quality Control: Achieving high dimensional accuracy and low surface roughness (Ra ~0.1 µm) depends critically on uniform coolant flow, precise blade tensioning, and rigid mounting of the workpiece (e.g., Si crystal ingot).

6CCVD Solutions & Capabilities

The research highlights the stringent requirements for processing hard, brittle monocrystalline materials, which directly aligns with the material science challenges faced by 6CCVD’s customers utilizing MPCVD diamond. 6CCVD provides the foundational material that necessitates this advanced cutting technology.

Applicable Materials

To replicate or extend research involving the precision cutting of hard monocrystals, 6CCVD recommends the following materials:

Single Crystal Diamond (SCD): Required for applications demanding the highest thermal conductivity, optical transparency, or electronic purity. 6CCVD offers Optical Grade SCD and Electronic Grade SCD plates, ideal for high-power optics, quantum sensing, and high-frequency electronics.
Polycrystalline Diamond (PCD): Suitable for large-area applications, heat spreaders, and structural components where extreme hardness and thermal management are critical. 6CCVD provides High Purity PCD plates.
Boron-Doped Diamond (BDD): Essential for electrochemical applications and advanced electrodes. 6CCVD supplies Heavy Boron Doped PCD and SCD substrates, which may require precision slicing for final electrode geometry.

Customization Potential

The paper emphasizes the need for precise dimensions and minimal material loss during slicing. 6CCVD’s capabilities directly support the preparation of precursor materials for these processes:

Requirement from Research	6CCVD Capability	Technical Specification
Precursor Material Size	Custom Dimensions	Plates/wafers up to 125 mm (PCD)
Material Thickness	Custom Thickness Control	SCD/PCD from 0.1 µm up to 500 µm
Substrate Handling	Thick Substrate Supply	Substrates available up to 10 mm thickness
Surface Quality (Post-Cut Finishing)	Ultra-Low Roughness Polishing	Ra < 1 nm (SCD), Ra < 5 nm (Inch-size PCD)
Device Integration	Custom Metalization	Internal capability for Au, Pt, Pd, Ti, W, Cu layers
Custom Shapes	Laser Cutting Services	Precision shaping and feature integration

Note on Surface Roughness: While the ID saw achieves a cut surface roughness of Ra ~0.1 µm (100 nm), 6CCVD’s standard polishing achieves Ra < 1 nm on SCD. Supplying highly polished material minimizes the need for extensive post-cut lapping and polishing, maximizing yield and reducing processing time for the end-user.

Engineering Support

6CCVD’s in-house PhD team specializes in optimizing diamond material properties for demanding applications. We offer consultation services to assist engineers and scientists in material selection for projects involving:

Wafer Slicing Yield: Selecting the optimal crystal orientation and surface preparation to minimize chipping and subsurface damage during high-precision ID sawing of SCD.
Thermal Management: Designing custom PCD heat spreaders with specific dimensions and metalization layers (e.g., Ti/Pt/Au) to ensure efficient heat dissipation in electronic devices.
Electrochemical Applications: Advising on the appropriate Boron doping level and surface termination for BDD electrodes requiring subsequent laser cutting or shaping.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

The article presents a specificity of cutting with abrasive diamond blade saws. The types of blades considering construction are discussed. Also possibilities of the application of this method in relation to various, hard - machinable mostly nonmetallic materials are described. Paper presents advantages and limitations concerning different types of blades.

Tech Support

Original Source

DOI: https://doi.org/10.17814/mechanik.2017.4.48