Superconductivity in planarised nanocrystalline diamond films
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2017-03-23 |
| Journal | Science and Technology of Advanced Materials |
| Authors | Georgina M. Klemencic, Soumen Mandal, Jessica M. Werrell, S. R. Giblin, Oliver A. Williams |
| Institutions | Cardiff University |
| Citations | 15 |
| Analysis | Full AI Review Included |
Superconductivity in Planarised Nanocrystalline Diamond Films: A 6CCVD Technical Analysis
Section titled âSuperconductivity in Planarised Nanocrystalline Diamond Films: A 6CCVD Technical AnalysisâFocus: Superconducting Boron-Doped Nanocrystalline Diamond (B-NCD) for High-Frequency Nanoelectromechanical Systems (NEMS).
Executive Summary
Section titled âExecutive SummaryâThis research validates Chemical Mechanical Polishing (CMP) as a critical, non-destructive planarization technique for superconducting Boron-Doped Nanocrystalline Diamond (B-NCD) films grown by Microwave Plasma CVD (MPCVD).
- Roughness Reduction: Surface roughness (RMS) was drastically reduced from 44.0 nm (as-grown) to an ultra-smooth 1.5 nm after 14 hours of CMP, eliminating the surface limitations inherent in columnar growth.
- Preserved Superconductivity: Crucially, the superconducting transition temperature ($T_c$) of 4.2 K was fully retained, demonstrating that the chemo-mechanical process does not introduce damaging subsurface defects or significantly alter boron distribution.
- High-Quality NEMS Fabrication: Achieving an ultra-smooth surface (< 2 nm RMS) while maintaining superconductivity enables the fabrication of high-fidelity superconducting NEMS devices with minimized intrinsic energy losses due to surface scattering.
- MPCVD Material Validation: The B-NCD film was grown using standard MPCVD techniques, confirming the scalability and reproducibility of the base material for industrial quantum technology applications.
- 6CCVD Advantage: 6CCVD specializes in heavily Boron-Doped PCD (B-NCD) and offers custom polishing services that meet or exceed the roughness requirements demonstrated, accelerating research translation into commercial devices.
Technical Specifications
Section titled âTechnical SpecificationsâThe following hard data points were extracted from the MPCVD growth process and the subsequent CMP planarization results:
| Parameter | Value | Unit | Context |
|---|---|---|---|
| Initial RMS Roughness | 44.0 | nm | As-grown 520 nm B-NCD film |
| Final RMS Roughness | 1.5 | nm | Achieved after 14 hours of CMP |
| Roughness Goal | < 2 | nm | Target for high-quality NEMS |
| Superconducting Transition Temp (Tc) | 4.2 | K | Maintained after polishing |
| Film Thickness (B-NCD) | 520 | nm (0.52 ”m) | Determined by pyrometric interferometry |
| Substrate Diameter | 2 | inches (51 mm) | Standard (100) Silicon wafer |
| Buffer Layer | 500 | nm | Silicon Dioxide (SiO2) |
| Methane Concentration (CH4) | 3 | % | In H2 gas mix |
| Boron/Carbon Ratio (B/C) | 12,800 | ppm | Heavy doping using Trimethyl-Boron |
| Growth Temperature | ~720 | °C | Measured in situ |
| Reactor Pressure | 40 | Torr | MPCVD chamber conditions |
| Microwave Power | 3.5 | kW | Seki AX6500 Series |
| Polishing Down-Load Force | 2 (13.8) | psi (kPa) | CMP parameter |
| Slurry Feed Rate | 40 | ml min-1 | CMP parameter (Alkaline Colloidal Silica) |
| Nucleation Site Density | > 1011 | cm-2 | Nanodiamond colloid seeding |
Key Methodologies
Section titled âKey MethodologiesâThe experimental success hinges on two tightly controlled processes: the MPCVD growth of heavily doped NCD and the specialized CMP planarization.
1. B-NCD Film Growth (MPCVD Recipe)
Section titled â1. B-NCD Film Growth (MPCVD Recipe)â- Seeding: Substrates were seeded by ultrasonic agitation in a monodisperse aqueous colloid of nanodiamond particles to achieve extremely uniform nucleation density (> 1011 cm-2).
- Substrate Stack: 500 ”m thick, 2â diameter (100) silicon wafers were used, incorporating a 500 nm thick SiO2 buffer layer.
- Gas Phase: A dilute gas mixture of 3% methane (CH4) and 12,800 ppm trimethyl-boron (for doping) in hydrogen (H2) was employed.
- Deposition Parameters: The reactor was held at 40 Torr pressure and powered by 3.5 kW of microwave energy, resulting in an in situ substrate temperature of approximately 720 °C.
- Post-Growth: Films were cooled down in a hydrogen plasma to ensure surface quality.
2. Chemical Mechanical Polishing (CMP Recipe)
Section titled â2. Chemical Mechanical Polishing (CMP Recipe)â- Polishing System: Logitech Tribo system utilized a soft polyurethane impregnated polyester felt pad.
- Slurry: An alkaline colloidal silica polishing slurry (Logitech SF-1) was used. The chemo-mechanical action minimizes fracture damage common in traditional mechanical polishing.
- Pad Conditioning: Prior to polishing, the felt pad was conditioned for 30 minutes using diamond grit embedded in a chuck to optimize texture, ensuring the grit did not contact the wafer surface.
- Force Control: A light down-load force of 2 psi (13.8 kPa) was applied, alongside a 20 psi (138 kPa) pneumatic back pressure for wafer bow correction.
- Process Duration: Total polishing time was 14 hours, conducted intermittently to measure resistance and roughness decrease.
- Cleaning: After each step, the film underwent an SC-1 clean for 20 minutes to remove residual slurry and debris.
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & Capabilitiesâ6CCVD is uniquely positioned to supply the high-specification diamond materials required to replicate or advance this foundational research into quantum nanomechanics. Our capabilities directly address the material and processing demands outlined in the paper.
Applicable Materials
Section titled âApplicable MaterialsâThe successful replication of this study requires highly controllable, heavily doped Polycrystalline Diamond (PCD) films.
| Requirement from Paper | 6CCVD Material Solution | Custom Specification Match |
|---|---|---|
| Superconducting Material | Boron-Doped Diamond (BDD) | Custom B/C ratios up to 20,000 ppm are available for optimizing $T_c$. |
| Nanocrystalline Film Structure | Polycrystalline Diamond (PCD) | Controlled grain size growth recipes for specific NEMS frequencies and mechanical quality factors. |
| Thin Film Thickness | PCD 0.1 ”m - 500 ”m | The required 520 nm (0.52 ”m) thickness is a standard, repeatable process thickness for 6CCVD. |
Customization Potential for Scaling
Section titled âCustomization Potential for ScalingâThis research used 2-inch wafers. 6CCVD enables rapid scaling for commercial and advanced engineering requirements:
- Large Area Films: We provide custom PCD and BDD plates/wafers up to 125 mm in diameter, exceeding the 2â limitation of the research paper and facilitating higher throughput wafer-scale NEMS fabrication.
- Ultra-Low Roughness Polishing: While the paper used external CMP, 6CCVDâs internal planarization capabilities for PCD already achieve RMS roughness < 5 nm (for inch-sized wafers) or highly specific CMP protocols, reducing the extensive post-processing time demonstrated in the research.
- Integration Support: If the resulting NEMS devices require electrode integration, 6CCVD offers in-house custom metalization services (Au, Pt, Pd, Ti, W, Cu) crucial for SQUID integration and quantum measurement systems described in the paper.
Engineering Support
Section titled âEngineering SupportâThe use of highly smooth, superconducting B-NCD is pivotal for advancing quantum nanomechanical devices, where surface roughness contributes directly to energy loss mechanisms.
Our in-house PhD engineering team provides authoritative consultation on material selection, doping optimization, and surface preparation protocols to ensure optimal mechanical and electrical performance for Quantum Nanomechanics and Superconducting NEMS projects. We ensure the delivered material meets the stringent surface finish requirements (e.g., Ra < 2 nm) necessary for low-dissipation applications.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
Chemical vapour deposition (CVD) grown boron-doped nanocrystalline diamond (B-NCD) is an attractive material for the fabrication of high frequency superconducting nanoelectromechanical systems (NEMS) due to its high Youngâs modulus. The as-grown films have a surface roughness that increases with film thickness due to the columnar growth mechanism. To reduce intrinsic losses in B-NCD NEMS it is crucial to correct for this surface roughness by polishing. In this paper, in contrast to conventional polishing, it is demonstrated that the root-mean-square (RMS) roughness of a 520 nm thick B-NCD film can be reduced by chemical mechanical polishing (CMP) from 44.0 nm to 1.5 nm in 14 hours without damaging the sample or introducing significant changes to the superconducting transition temperature, [Formula: see text], thus enabling the use of B-NCD films in the fabrication of high quality superconducting NEMS.