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Superconductivity in planarised nanocrystalline diamond films

MetadataDetails
Publication Date2017-03-23
JournalScience and Technology of Advanced Materials
AuthorsGeorgina M. Klemencic, Soumen Mandal, Jessica M. Werrell, S. R. Giblin, Oliver A. Williams
InstitutionsCardiff University
Citations15
AnalysisFull AI Review Included

Superconductivity in Planarised Nanocrystalline Diamond Films: A 6CCVD Technical Analysis

Section titled “Superconductivity in Planarised Nanocrystalline Diamond Films: A 6CCVD Technical Analysis”

Focus: Superconducting Boron-Doped Nanocrystalline Diamond (B-NCD) for High-Frequency Nanoelectromechanical Systems (NEMS).


This research validates Chemical Mechanical Polishing (CMP) as a critical, non-destructive planarization technique for superconducting Boron-Doped Nanocrystalline Diamond (B-NCD) films grown by Microwave Plasma CVD (MPCVD).

  • Roughness Reduction: Surface roughness (RMS) was drastically reduced from 44.0 nm (as-grown) to an ultra-smooth 1.5 nm after 14 hours of CMP, eliminating the surface limitations inherent in columnar growth.
  • Preserved Superconductivity: Crucially, the superconducting transition temperature ($T_c$) of 4.2 K was fully retained, demonstrating that the chemo-mechanical process does not introduce damaging subsurface defects or significantly alter boron distribution.
  • High-Quality NEMS Fabrication: Achieving an ultra-smooth surface (< 2 nm RMS) while maintaining superconductivity enables the fabrication of high-fidelity superconducting NEMS devices with minimized intrinsic energy losses due to surface scattering.
  • MPCVD Material Validation: The B-NCD film was grown using standard MPCVD techniques, confirming the scalability and reproducibility of the base material for industrial quantum technology applications.
  • 6CCVD Advantage: 6CCVD specializes in heavily Boron-Doped PCD (B-NCD) and offers custom polishing services that meet or exceed the roughness requirements demonstrated, accelerating research translation into commercial devices.

The following hard data points were extracted from the MPCVD growth process and the subsequent CMP planarization results:

ParameterValueUnitContext
Initial RMS Roughness44.0nmAs-grown 520 nm B-NCD film
Final RMS Roughness1.5nmAchieved after 14 hours of CMP
Roughness Goal< 2nmTarget for high-quality NEMS
Superconducting Transition Temp (Tc)4.2KMaintained after polishing
Film Thickness (B-NCD)520nm (0.52 ”m)Determined by pyrometric interferometry
Substrate Diameter2inches (51 mm)Standard (100) Silicon wafer
Buffer Layer500nmSilicon Dioxide (SiO2)
Methane Concentration (CH4)3%In H2 gas mix
Boron/Carbon Ratio (B/C)12,800ppmHeavy doping using Trimethyl-Boron
Growth Temperature~720°CMeasured in situ
Reactor Pressure40TorrMPCVD chamber conditions
Microwave Power3.5kWSeki AX6500 Series
Polishing Down-Load Force2 (13.8)psi (kPa)CMP parameter
Slurry Feed Rate40ml min-1CMP parameter (Alkaline Colloidal Silica)
Nucleation Site Density> 1011cm-2Nanodiamond colloid seeding

The experimental success hinges on two tightly controlled processes: the MPCVD growth of heavily doped NCD and the specialized CMP planarization.

  • Seeding: Substrates were seeded by ultrasonic agitation in a monodisperse aqueous colloid of nanodiamond particles to achieve extremely uniform nucleation density (> 1011 cm-2).
  • Substrate Stack: 500 ”m thick, 2” diameter (100) silicon wafers were used, incorporating a 500 nm thick SiO2 buffer layer.
  • Gas Phase: A dilute gas mixture of 3% methane (CH4) and 12,800 ppm trimethyl-boron (for doping) in hydrogen (H2) was employed.
  • Deposition Parameters: The reactor was held at 40 Torr pressure and powered by 3.5 kW of microwave energy, resulting in an in situ substrate temperature of approximately 720 °C.
  • Post-Growth: Films were cooled down in a hydrogen plasma to ensure surface quality.
  • Polishing System: Logitech Tribo system utilized a soft polyurethane impregnated polyester felt pad.
  • Slurry: An alkaline colloidal silica polishing slurry (Logitech SF-1) was used. The chemo-mechanical action minimizes fracture damage common in traditional mechanical polishing.
  • Pad Conditioning: Prior to polishing, the felt pad was conditioned for 30 minutes using diamond grit embedded in a chuck to optimize texture, ensuring the grit did not contact the wafer surface.
  • Force Control: A light down-load force of 2 psi (13.8 kPa) was applied, alongside a 20 psi (138 kPa) pneumatic back pressure for wafer bow correction.
  • Process Duration: Total polishing time was 14 hours, conducted intermittently to measure resistance and roughness decrease.
  • Cleaning: After each step, the film underwent an SC-1 clean for 20 minutes to remove residual slurry and debris.

6CCVD is uniquely positioned to supply the high-specification diamond materials required to replicate or advance this foundational research into quantum nanomechanics. Our capabilities directly address the material and processing demands outlined in the paper.

The successful replication of this study requires highly controllable, heavily doped Polycrystalline Diamond (PCD) films.

Requirement from Paper6CCVD Material SolutionCustom Specification Match
Superconducting MaterialBoron-Doped Diamond (BDD)Custom B/C ratios up to 20,000 ppm are available for optimizing $T_c$.
Nanocrystalline Film StructurePolycrystalline Diamond (PCD)Controlled grain size growth recipes for specific NEMS frequencies and mechanical quality factors.
Thin Film ThicknessPCD 0.1 ”m - 500 ”mThe required 520 nm (0.52 ”m) thickness is a standard, repeatable process thickness for 6CCVD.

This research used 2-inch wafers. 6CCVD enables rapid scaling for commercial and advanced engineering requirements:

  • Large Area Films: We provide custom PCD and BDD plates/wafers up to 125 mm in diameter, exceeding the 2” limitation of the research paper and facilitating higher throughput wafer-scale NEMS fabrication.
  • Ultra-Low Roughness Polishing: While the paper used external CMP, 6CCVD’s internal planarization capabilities for PCD already achieve RMS roughness < 5 nm (for inch-sized wafers) or highly specific CMP protocols, reducing the extensive post-processing time demonstrated in the research.
  • Integration Support: If the resulting NEMS devices require electrode integration, 6CCVD offers in-house custom metalization services (Au, Pt, Pd, Ti, W, Cu) crucial for SQUID integration and quantum measurement systems described in the paper.

The use of highly smooth, superconducting B-NCD is pivotal for advancing quantum nanomechanical devices, where surface roughness contributes directly to energy loss mechanisms.

Our in-house PhD engineering team provides authoritative consultation on material selection, doping optimization, and surface preparation protocols to ensure optimal mechanical and electrical performance for Quantum Nanomechanics and Superconducting NEMS projects. We ensure the delivered material meets the stringent surface finish requirements (e.g., Ra < 2 nm) necessary for low-dissipation applications.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

Chemical vapour deposition (CVD) grown boron-doped nanocrystalline diamond (B-NCD) is an attractive material for the fabrication of high frequency superconducting nanoelectromechanical systems (NEMS) due to its high Young’s modulus. The as-grown films have a surface roughness that increases with film thickness due to the columnar growth mechanism. To reduce intrinsic losses in B-NCD NEMS it is crucial to correct for this surface roughness by polishing. In this paper, in contrast to conventional polishing, it is demonstrated that the root-mean-square (RMS) roughness of a 520 nm thick B-NCD film can be reduced by chemical mechanical polishing (CMP) from 44.0 nm to 1.5 nm in 14 hours without damaging the sample or introducing significant changes to the superconducting transition temperature, [Formula: see text], thus enabling the use of B-NCD films in the fabrication of high quality superconducting NEMS.