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Characterization of Carbon Thin Films Prepared by High Power Impulse Magnetron Sputtering

MetadataDetails
Publication Date2017-01-01
JournalJournal of the Vacuum Society of Japan
AuthorsNorio Nawachi, Koichi Itoh, Yosuke ISAGI, Yoshiaki Yoshida, Keishi Okamoto
InstitutionsOkayama University of Science, Toyo Engineering (Japan)
AnalysisFull AI Review Included

6CCVD Technical Documentation: High-Performance Carbon Films via Advanced PVD Methods

Section titled “6CCVD Technical Documentation: High-Performance Carbon Films via Advanced PVD Methods”

Document Reference: Analysis of “Characterization of Carbon Thin Films Prepared by High Power Impulse Magnetron Sputtering” Subject: High Hardness, High Density Diamond-Like Carbon (DLC) Film Structure and Optimization Applicable 6CCVD Materials: Single Crystal Diamond (SCD), Polycrystalline Diamond (PCD), and Boron-Doped Diamond (BDD)


This research leverages High Power Impulse Magnetron Sputtering (HiPIMS) combined with Multipolar Magnetic Plasma Confinement (MMPC) to produce highly dense and hard carbon films. This advanced deposition technique and the focus on optimizing carbon structure align directly with 6CCVD’s core expertise in ultra-hard, customized diamond materials.

  • Structure Optimization: The HiPIMS-MMPC method successfully promotes the formation of tetrahedral amorphous carbon (ta-C) structure, deemed more effective than the graphitic (nc-G) structure produced by standard HiPIMS.
  • Superior Performance: DLC films achieved a maximum hardness of approximately 20 GPa and a maximum density of 2.00 g/cm3.
  • Method Efficacy: The inclusion of MMPC significantly increased plasma density near the substrate, improving ion bombardment and yielding denser, harder films, despite a corresponding reduction in deposition rate (less than half that of standard HiPIMS).
  • High Power Recipe: The optimized recipe utilized a high peak power density of 690 W/cm2 at a low 1% duty cycle.
  • 6CCVD Relevance: While this paper focuses on DLC, 6CCVD specializes in MPCVD diamond, which offers intrinsic hardness (typically >90 GPa) and density far exceeding these films, eliminating the structural compromises inherent in amorphous carbon materials.
  • Application Crossover: The need for materials exhibiting extreme hardness and controlled density highlights applications requiring superior wear resistance, precision optics, and advanced electronic interfaces—areas where 6CCVD’s custom SCD and PCD excel.

The following table summarizes the critical material properties and processing parameters extracted from the research paper.

ParameterValueUnitContext
Maximum Hardness (HiPIMS-MMPC)20GPaAchieved at various biases
Maximum Density (HiPIMS-MMPC)2.00g/cm3Bias Voltage: -200 V
Target MaterialGraphite(99.99% purity)Diameter: 210 mm, Thickness: 5 mm
Substrate MaterialSiliconSiDepositions conducted at room temperature
Gas AtmosphereArgonAr
Chamber Pressure0.5PaStandard deposition pressure
Target Voltage (Applied)-900VFixed setting for pulse
Maximum Peak Current633AHiPIMS-MMPC, 1% Duty Cycle
Peak Power Density690W/cm2Calculated for 1% Duty Cycle
Optimized Duty Cycle1%Used for stable plasma discharge
Frequency200HzPulse repetition rate
Pulse Duration50”sFixed pulse width
Substrate Bias Voltages-100, -200, -300VUsed to control ion energy and structure
Max Surface Roughness (Rz)5.6nmHiPIMS-MMPC, Bias -300 V
Max Deposition Rate (HiPIMS-MMPC)11.0nm/minBias -300 V (Half the rate of standard HiPIMS)

The experimental setup utilized two carbon film preparation methods for comparison: standard HiPIMS and HiPIMS combined with Multipolar Magnetic Plasma Confinement (HiPIMS-MMPC). The critical steps and recipe parameters are listed below:

  1. System Setup: A graphite target was used with a high-power DC source (iPulse10000). The HiPIMS-MMPC system incorporated permanent magnets (Nd-Fe-B) both behind the target and on the target sides to concentrate and draw the plasma toward the silicon (Si) substrate.
  2. Atmosphere Control: Depositions were conducted in an Argon (Ar) gas atmosphere maintained at a constant pressure of 0.5 Pa.
  3. High Power Pulse Parameters: A critical, stable discharge was achieved using the following fixed parameters:
    • Applied Target Voltage: -900 V.
    • Duty Cycle: 1% (optimized for stability and high peak power).
    • Frequency: 200 Hz.
    • Pulse Duration: 50 ”s.
  4. Structural Control: Substrate bias voltages (-100 V, -200 V, -300 V) were applied to the Si wafers to accelerate incident ions, promoting the necessary subsurface collision cascade required for forming the dense, hard ta-C (tetrahedral amorphous carbon) structure, as confirmed by Raman analysis (stable I(D)/I(G) ratio near 1.0).
  5. Characterization: The resulting carbon films were analyzed rigorously for performance metrics:
    • Structure: Raman Spectroscopy (identifying D-band and G-band characteristics).
    • Hardness: Nanoindentation (Hysitron Triboscope).
    • Density: X-ray Reflectometry (XRR).
    • Morphology: Stylus Profilometry (Rz and deposition rate).

This research demonstrates a sophisticated approach to creating high-performance carbon films under controlled plasma conditions. 6CCVD specializes in bulk, single-phase crystalline diamond—the ultimate carbon material—grown via MPCVD, providing engineering solutions that offer superior hardness, thermal conductivity, and chemical inertness for demanding applications.

The requirements for extreme hardness and density observed in this paper are ideally met and surpassed by 6CCVD’s catalog of MPCVD diamond materials:

Required Application Feature6CCVD Material RecommendationRationale
Extreme Hardness & Wear ResistanceSCD (Single Crystal Diamond)Intrinsic hardness >90 GPa. Available in optical and electronic grades.
High Density & UniformityPCD (Polycrystalline Diamond)High consistency, large area coverage up to 125mm. Highly competitive cost-to-performance ratio for mechanical applications.
Conductivity & ElectrochemistryBoron-Doped Diamond (BDD)Achieves high conductivity, suitable for electrode applications, potentially replacing high-density DLC in conductive/sensing environments.
Advanced Interface LayersOptical Grade SCDSubstrates or windows up to 500”m thick, offering unparalleled purity and surface finish (Ra < 1nm).

The PVD techniques explored in the paper focus on achieving optimized interfaces and density on substrates. 6CCVD offers extensive customization capabilities critical for integrating high-performance diamond materials into complex systems:

  • Custom Dimensions: We offer PCD and SCD plates/wafers with custom shapes and dimensions, with PCD available up to 125 mm in diameter, exceeding typical research dimensions.
  • Thickness Control: Precision control allows for film thickness from 0.1 ”m to 500 ”m for both SCD and PCD layers, as well as thick substrates up to 10 mm.
  • Ultra-Low Roughness Polishing: Achieving low roughness is key for reducing friction and scattering. 6CCVD guarantees surface finishes of Ra < 1 nm for SCD and Ra < 5 nm for inch-size PCD, significantly surpassing the Rz=5.6 nm observed in the analyzed DLC films.
  • Integrated Metalization: 6CCVD provides in-house metalization services, including common electrode and bonding layers such as Au, Pt, Pd, Ti, W, and Cu, allowing researchers to directly integrate our diamond into complex devices, potentially leveraging PVD techniques like those described here for interface preparation.

The challenges described in optimizing the ta-C structure via plasma density control are analogous to the challenges 6CCVD’s experts solve daily in controlling nitrogen inclusion, crystal orientation, and defect density in MPCVD diamond growth. 6CCVD’s in-house PhD engineering team can assist with material selection, interface design, and dimensional specification for similar high-wear, high-density, or advanced semiconductor projects, ensuring optimal performance from initial concept through final fabrication.

6CCVD ships high-quality MPCVD diamond globally, simplifying procurement through DDU (default) and DDP shipping options. For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

The characteristics of diamond-like carbon (DLC) films deposited by high power impulse magnetron sputtering (HiPIMS) with multipolar magnetic plasma confinement (MMPC) were investigated. DLC films were prepared on silicon (Si) by HiPIMS and HiPIMS-MMPC over varying substrate bias voltage. Depositions were performed from a graphite target (210 mm in diameter) under argon (Ar) gas atmosphere at chamber pressure of 0.5 Pa. The DLC films were analyzed by several methods. In HiPIMS-MMPC, the peak power density was approximately 690 W/cm2 at a duty cycle of 1% (frequency: 200 Hz). According to Raman spectroscopy, the structure of DLC film deposited by HiPIMS-MMPC could be changed from amorphous carbon (a-C) to tetrahedral amorphous carbon (ta-C). The deposition rate in HiPIMS-MMPC was approximately 50% (10 nm/min) lower than that in HiPIMS. However, HiPIMS-MMPC is considered as one of the effective methods to prepare hard and dense DLC films (20 GPa and 2.00 g/cm3 at the maximum).