Size Dependence of Nanoscale Wear of Silicon Carbide
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2016-12-20 |
| Journal | ACS Applied Materials & Interfaces |
| Authors | Chaiyapat Tangpatjaroen, David S. Grierson, Steven Shannon, Joseph E. Jakes, Izabela Szlufarska |
| Institutions | University of WisconsinâMadison, North Carolina State University |
| Citations | 26 |
| Analysis | Full AI Review Included |
Size Dependence of Nanoscale Wear in SiC: Analysis and Diamond Solutions
Section titled âSize Dependence of Nanoscale Wear in SiC: Analysis and Diamond SolutionsâThis document analyzes the research detailing the size-dependent wear mechanisms of Silicon Carbide (SiC) at the nanoscale. It connects the findings, particularly the critical role of ultra-hard, precisely shaped diamond counter-surfaces, to the manufacturing capabilities and materials provided by 6CCVD, a leading supplier of Microwave Plasma Chemical Vapor Deposition (MPCVD) diamond materials.
Executive Summary
Section titled âExecutive SummaryâThis research reveals a critical transition in the tribological behavior of Single Crystal Silicon Carbide (sc-SiC) and Nanocrystalline Silicon Carbide (nc-SiC) at the nanoscale, directly impacting the design of Micro/Nanoelectromechanical Systems (MEMS/NEMS).
- Size-Dependent Wear Reversal: At macro/micro scales (using tips with R â 370 nm), SiC exhibits expected high wear resistance proportional to its superior hardness (37 GPa). However, at the nanoscale (using tips with R â 20 nm), SiC surprisingly demonstrates lower wear resistance than softer silicon (Si) and silicon oxide (SiOx).
- Mechanism Transition: This reversal is driven by a switch in the dominant wear mechanism: from plowing (governed by bulk hardness) at large contacts to adhesive wear/interfacial shear (governed by surface chemistry and shear strength) at small contacts.
- High Interfacial Shear Strength: The study confirmed that sc-SiC possesses a significantly higher interfacial shear strength (210 ± 48 MPa) compared to Si (72 ± 15 MPa), making it prone to atomic-level removal under low loads.
- Diamond Tooling Requirement: The investigation fundamentally relies on ultra-precise diamond counter-surfaces, utilizing both single-crystal diamond (SCD) nanoindenter tips and nanocrystalline diamond (PCD/NCD) AFM tips for accurate, single-asperity testing.
- Implication for 6CCVD: These findings emphasize the necessity of high-quality, geometrically precise MPCVD diamond tips and coatings for accurate nanoscale tribology and the development of next-generation, friction-optimized NEMS devices.
Technical Specifications
Section titled âTechnical SpecificationsâThe following key material and experimental parameters were extracted from the study, highlighting the extreme conditions and material properties under investigation.
| Parameter | Value | Unit | Context |
|---|---|---|---|
| sc-SiC Hardness | 37 ± 1 | GPa | Single Crystal 4H-SiC (0001) wafer average. |
| nc-SiC Hardness | 26 ± 2 | GPa | Nanocrystalline 3C-SiC film average. |
| Si Hardness | 12.6 ± 0.2 | GPa | Single Crystal Si (100) average. |
| sc-SiC Elastic Modulus | 397 ± 8.5 | GPa | Measured via Oliver-Pharr method. |
| nc-SiC Film Thickness | 500 | nm | As-deposited, CVD grown film. |
| Nanoindenter Tip Radius (Rtip) | 370 | nm | Single Crystal Berkovich Diamond tip (Large Contact). |
| AFM Tip Radius Range (Rtip) | 11 to 27 | nm | Nanocrystalline Diamond tips (Small Contact). |
| Nanoindenter Load Range | 50 to 2000 | ”N | Wear dominated by Plowing mechanism. |
| AFM Load Range | 120 nN to 3.5 ”N | nN/”N | Wear dominated by Interfacial Shear mechanism. |
| Interfacial Shear Strength (sc-SiC) | 210 ± 48 | MPa | Highest measured shear strength; cause of high nanoscale wear. |
| Surface Roughness (sc-SiC Rq) | 0.19 ± 0.08 | nm | Measured over 0.09 ”m2 area post-polishing/ion milling. |
| Test Environment | < 3 ± 3 | % | Relative Humidity (Dry Nitrogen atmosphere). |
Key Methodologies
Section titled âKey MethodologiesâThe experiment relied on precise MPCVD diamond probes and rigorous surface preparation to isolate nanoscale wear mechanisms in a controlled, dry environment.
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Material Growth and Preparation:
- Single-crystal 4H-SiC (0001) wafers (CREEÂź) and nanocrystalline 3C-SiC thin films (CVD grown, {111} texture) were utilized.
- sc-SiC samples were mechanically polished using diamond papers down to 0.1 ”m grit, followed by ultrasonic cleaning and final ion milling (1 kV, 20 minutes) to achieve Rq â 0.2 nm.
- nc-SiC films were solely prepared by ion milling to Rq â 0.3 nm.
- Reference Si wafers were prepared with both thin and thick (~16 nm) native oxide layers.
-
Macro/Micro Scratch Test (Plowing Regime):
- A Hysitron TI 950 TriboIndenter was used with a Single Crystal Diamond Berkovich tip (R â 370 nm).
- Six parallel scratches were formed under varying normal loads (50 ”N to 2 mN).
- Each scratch consisted of 500 reciprocal cycles (3 ”m length) conducted in a dry nitrogen environment.
-
Nanoscale Scratch Test (Interfacial Shear Regime):
- A Multimode 8 AFM was used with Nanocrystalline Diamond AFM tips (R â 11-27 nm).
- Seven parallel scratches were formed under loads ranging from 120 nN to 3.5 ”N.
- Each scratch consisted of 2,400 reciprocal cycles (3 ”m length).
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Wearless Regime Friction Measurement:
- Friction vs. load curves were measured using a nanocrystalline diamond AFM tip (R â 20 nm equivalent), with loads varied up to 120 nN, ensuring no permanent deformation.
- Interfacial shear strength (Ï) was calculated by fitting the data to the Maugis-Dugdale model using the Carpick-Ogletree-Salmeron (COS) equation.
-
Characterization:
- Hardness and elastic modulus were measured by nanoindentation (Oliver-Pharr method).
- Wear depth and volume were measured post-test via AFM imaging, supplemented by Focused Ion Beam (FIB) cross-sectioning for maximum accuracy.
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & CapabilitiesâThis study underscores the critical relationship between material properties (Hardness, Shear Strength) and contact geometry (Tip Radius) in ultra-hard materials like SiC and diamond. 6CCVD provides the necessary high-purity MPCVD diamond materials and specialized fabrication services required to replicate this research, optimize next-generation tribological systems, and scale NEMS/MEMS production.
| Applicable Materials & Components | Research Requirement & Context | 6CCVD Solution & Value Proposition |
|---|---|---|
| Single Crystal Diamond (SCD) Material | Required for stable, high-precision nanoindenter tips (R â 370 nm) and substrates for high-frequency NEMS resonators. | Optical Grade SCD Wafers: We supply high-purity SCD plates (0.1 ”m to 500 ”m thick, Ra < 1 nm polished) suitable for fabricating the most durable and dimensionally accurate single-crystal diamond tooling and device components. |
| Nanocrystalline Diamond (PCD) / NCD | Required for nanoscale AFM tips (R â 11-27 nm) used in interfacial shear studies, proving superior stability to Si tips. | Custom PCD Plates & Films: 6CCVD provides MPCVD PCD plates up to 125 mm in diameter, perfect for advanced, large-format tribological studies or the mass fabrication of NCD tips/coatings used in scanning probe applications. |
| Boron-Doped Diamond (BDD) | Future MEMS/NEMS devices replacing SiC require high hardness plus superior electrical conductivity, often in harsh (high temp, nuclear) environments. | Heavy Boron Doped Diamond (BDD): BDD offers exceptional mechanical hardness combined with tunable conductivity, making it an ideal candidate material to exceed SiC performance in tribologically sensitive, electrically active MEMS for nuclear or high-temperature applications. |
| Surface Finish & Metrology | SiC samples required ultra-low surface roughness (Rq < 0.3 nm) for reliable nanoscale testing. | Precision Polishing Service: Our capability ensures ultra-flat surfaces (SCD Ra < 1 nm; inch-size PCD Ra < 5 nm), mandatory for research into interfacial shear and adhesion where surface chemistry and roughness are primary variables. |
| Device Integration & Customization | Integration of hard coatings into devices (e.g., SiC coatings reducing adhesion in Si-based MEMS, as cited). | Custom Metalization and Etching: We offer in-house metalization (Au, Pt, Pd, Ti, W, Cu) and precise laser cutting services to achieve complex geometries and robust electrical contacts, simplifying the integration of diamond into high-performance microstructures. |
Engineering Support
Section titled âEngineering SupportâThe observed nanoscale wear phenomenaâwhere hardness is decoupled from wear resistanceâhighlights the need for advanced material design. 6CCVDâs in-house PhD team provides consultative support to engineers and researchers focused on designing tribologically optimized components for MEMS/NEMS applications, leveraging the unique mechanical, thermal, and chemical properties of MPCVD diamond.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
Nanoscale, single-asperity wear of single-crystal silicon carbide (sc-SiC) and nanocrystalline silicon carbide (nc-SiC) is investigated using single-crystal diamond nanoindenter tips and nanocrystalline diamond atomic force microscopy (AFM) tips under dry conditions, and the wear behavior is compared to that of single-crystal silicon with both thin and thick native oxide layers. We discovered a transition in the relative wear resistance of the SiC samples compared to that of Si as a function of contact size. With larger nanoindenter tips (tip radius â 370 nm), the wear resistances of both sc-SiC and nc-SiC are higher than that of Si. This result is expected from the Archardâs equation because SiC is harder than Si. However, with the smaller AFM tips (tip radius â 20 nm), the wear resistances of sc-SiC and nc-SiC are lower than that of Si, despite the fact that the contact pressures are comparable to those applied with the nanoindenter tips, and the plastic zones are well-developed in both sets of wear experiments. We attribute the decrease in the relative wear resistance of SiC compared to that of Si to a transition from a wear regime dominated by the materialsâ resistance to plastic deformation (i.e., hardness) to a regime dominated by the materialsâ resistance to interfacial shear. This conclusion is supported by our AFM studies of wearless friction, which reveal that the interfacial shear strength of SiC is higher than that of Si. The contributions of surface roughness and surface chemistry to differences in interfacial shear strength are also discussed.
Tech Support
Section titled âTech SupportâOriginal Source
Section titled âOriginal SourceâReferences
Section titled âReferencesâ- 2008 - Tribology on the Small Scale: A Bottom Up Approach to Friction, Lubrication, and Wear