New Simulation based Method for the Design of Cut-Off Grinding Segments for Circular Saws
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2015-11-20 |
| Journal | UB Bochum |
| Authors | Berend Denkena, Thilo Grove, Andreas Ermisch, T. Göttsching |
| Institutions | Leibniz University Hannover |
| Citations | 3 |
| Analysis | Full AI Review Included |
Technical Documentation & Analysis: Deterministic Diamond Grain Pattern Optimization
Section titled âTechnical Documentation & Analysis: Deterministic Diamond Grain Pattern OptimizationâThis document analyzes the research paper âNew Simulation based Method for the Design of Cut-Off Grinding Segments for Circular Sawsâ to highlight key technical requirements and demonstrate how 6CCVDâs advanced MPCVD diamond solutions meet and exceed the needs of this specialized field.
Executive Summary
Section titled âExecutive SummaryâThis research validates a new simulation approach (CutS©) for designing optimized, multi-layer deterministic diamond grain patterns in cut-off grinding segments, moving beyond traditional stochastic distributions.
- 3D Pattern Necessity: The study confirms the need for precise 3D grain positioning (axial, tangential, radial distances: a, b, c) to maximize material removal volume and manage tool wear in multi-layer segments.
- Critical Parameter Identification: Axial grain distance (b) is identified as the most important parameter for maximizing removed material volume, requiring minimal spacing for complete material removal.
- Material Removal Modeling: The simulation successfully incorporates material removal factors (k=1 for ductile, k=2 for brittle) to predict optimal grain alignment based on the workpiece material (e.g., granite vs. reinforcement steel).
- Wear Rate Control: Deterministic radial grain alignment (distance c) significantly smoothens the radial wear rate and reduces sudden wear increases compared to stochastically distributed tools, leading to longer, more predictable tool life.
- Process Force Management: The research establishes a limit on the number of active grains (and thus, the tangential distance âaâ) to prevent excessive process forces, which is critical for low-power, transportable cutting machines.
- Future Requirements: Future segment designs will require 9 to 12 layers of precisely placed diamond grains, demanding highly uniform and customizable diamond material.
Technical Specifications
Section titled âTechnical SpecificationsâThe following hard data points were extracted from the simulation and experimental parameters used in the study:
| Parameter | Value | Unit | Context |
|---|---|---|---|
| Diamond Grain Size (dg) | 400 - 600 | ”m | Range used for segments |
| Cutting Speed (Vc) | 30 | m/s | Experimental process parameter |
| Infeed Speed (Vf) | 1.33 | m/min | Experimental process parameter |
| Cutting Depth (ae) | 30 | mm | Experimental process parameter |
| Tool Diameter (Dtool) | 1000 | mm | Diameter of the circular saw blade |
| Segment Length (lseg) | 20 | mm | Standard segment dimension |
| Segment Width (wseg) | 7 | mm | Standard segment dimension |
| Segment Height (hseg) | 12 | mm | Standard segment dimension (multi-layer) |
| Brittle Material Removal Factor (k) | 2 | - | Used for granite (brittle material) |
| Ductile Material Removal Factor (k) | 1 | - | Used for reinforcement steel (ductile material) |
| Optimal Tangential Distance (a) | 3 | mm | Suggested for building wear stock |
| Radial Wear (Îr) | 0.4 | mm | Wear after 4 m2 cut surface (equal to grain size) |
| Required Chip Thickness (hcu) | 10 | ”m | Optimal value for positive wear behavior |
Key Methodologies
Section titled âKey MethodologiesâThe research utilized a combination of advanced simulation and real-world validation to define optimal 3D grain patterns.
- Simulation Software Development: The in-house material removal software CutS© (Version 2.1) was adapted to model cut-off grinding, incorporating simplified grain models (truncated octahedrons/dodecahedrons) with statistically chosen sizes and orientations (FEPA tolerances).
- 3D Parametrization: A new parametrization system was implemented to define grain distances (a, b, c) and displacement possibilities across three room axes, enabling the design of multi-layer segments.
- Material Removal Mechanism Integration: Algorithms were introduced to scale single grain models based on the material removal factor (k), differentiating between brittle (k > 1) and ductile (k ≤ 1) material interactions.
- Simplified Wear Modeling: Wear was calculated as a size reduction of the grain proportional to the removed volume, and grains were deactivated/removed from the tool model upon exceeding an adjustable maximum load.
- Experimental Validation: Real cutting tests were performed on hard-to-cut Rosa Sardo granite using a Hensel Gigant 459 bridge saw, comparing four different 1-meter diameter saw blades (two deterministic, two stochastic) to validate simulation predictions regarding process forces and radial wear.
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & CapabilitiesâThe findings of this research underscore the necessity for high-precision, high-strength diamond materials to realize optimized 3D deterministic grain patterns. 6CCVDâs MPCVD diamond technology is uniquely positioned to supply the materials required to replicate and advance this critical tooling research.
Applicable Materials for Deterministic Tooling
Section titled âApplicable Materials for Deterministic ToolingâThe paper requires diamond grains with highly controlled size, shape, and placement across multiple layers (9 to 12 layers anticipated). 6CCVD recommends the following materials:
| 6CCVD Material | Application Focus | Key Advantage for this Research |
|---|---|---|
| Polycrystalline Diamond (PCD) Plates | Multi-layer segment manufacturing, high-impact cutting (granite, concrete). | Provides superior fracture toughness and thermal stability required for high-speed, high-load grinding. Can be manufactured in large plates (up to 125mm) for precise segment cutting. |
| SCD (Single Crystal Diamond) | Micro-tooling, ultra-precision segments, or defining the initial active layer. | Highest purity and structural integrity. Ideal for applications requiring minimal wear and maximum consistency in the initial cutting layer (Ra < 1nm polishing available). |
| Custom Diamond Grain Precursors | Advanced tool bonding and matrix integration. | 6CCVD can supply MPCVD diamond material tailored for specific grain size ranges (e.g., 400-600 ”m) with controlled morphology, ensuring optimal performance within the segment matrix. |
Customization Potential for 3D Grain Patterning
Section titled âCustomization Potential for 3D Grain PatterningâThe success of deterministic tooling relies on the ability to place diamonds precisely in three dimensions (a, b, c). 6CCVD supports this requirement through unparalleled material customization:
- Custom Dimensions: We provide PCD plates and wafers up to 125mm in diameter, allowing researchers to laser-cut segments (20 mm x 7 mm x 12 mm) from highly uniform MPCVD material.
- Thickness Control: Our precise thickness control for PCD (0.1 ”m to 500 ”m) is essential for defining the exact depth and spacing of the multi-layer structure (radial distance âcâ) required to achieve stable wear rates. Substrates up to 10mm are available for robust backing.
- High-Precision Polishing: For segments requiring minimal initial friction or specific surface topography, 6CCVD offers ultra-smooth polishing down to Ra < 1nm for SCD and Ra < 5nm for inch-size PCD.
- Metalization Services: While the paper focuses on sintered tools, if brazing or electroplating is utilized for bonding the deterministic grains, 6CCVD offers in-house metalization capabilities including Ti, W, Au, Pt, Pd, and Cu for optimal adhesion to the segment matrix.
Engineering Support & Research Extension
Section titled âEngineering Support & Research ExtensionâThe determination of the optimal grain pattern is highly dependent on the work materialâs removal factor (k) and the specific process kinematics.
- Material Selection Expertise: 6CCVDâs in-house PhD team specializes in correlating diamond material properties (e.g., grain boundary structure, nitrogen content) with application performance. We can assist researchers in defining the optimal MPCVD diamond grade for similar Cut-Off Grinding and Material Removal Simulation projects, ensuring the diamond material matches the required k-factor performance (brittle vs. ductile cutting).
- Global Supply Chain: We offer reliable global shipping (DDU default, DDP available) to ensure researchers worldwide receive high-quality, custom diamond materials quickly and efficiently.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
A new trend in the field of cut-off grinding tools such as circular saws is the application of deterministic grain pattern, e.g. the ARIX-System. Although the improved performance of these tools has been proven in a quarry exemplarily, it is not clear how to configure an optimized grain pattern. It is assumed that the work material, the cutting parameters and the tool dimensions have an influence on these pattern. In this paper a new method is presented for the design of cut-off grinding segments for circular saws with defined grain pattern, which is based on the in-house material removal simulation software CutS. With this simulation, the influence of variable grain pattern on tool performance and tool life can be tested without the need for cutting experiments. It is possible to test different material specifications through the consideration of brittle and ductile material removal mechanisms and adjustable material removal factors. The influence of macroscopic and microscopic tool wear on the optimized positioning of grains by means of material removal rate and wear rate is investigated. With special algorithms, it is also possible to simulate standard tools with stochastically distributed diamond grains. Computed results will be compared to real cutting experiments of granite with cut-off grinding segments designed with CutS.