Optimizing Diamond Heat Spreaders for Thermal Management of Hotspots for GaN Devices
At a Glance
Section titled āAt a Glanceā| Metadata | Details |
|---|---|
| Publication Date | 2015-10-01 |
| Journal | IMAPSource Proceedings |
| Authors | Thomas Obeloer, Bruce Bolliger, Yong Han, Boon Long Lau, Gongyue Tang |
| Institutions | Institute of Microelectronics, Element Six (United States) |
Abstract
Section titled āAbstractāAs devices become smaller while still requiring high reliability in the presence of extreme power densities, new thermal management solutions are needed. Nowhere is this more evident than with the use of Gallium Nitride (GaN) transistors, where engineers struggle with the thermal barriers limiting the ability to achieve the intrinsic performance potential of GaN semiconductor devices. Emerging as a common solution to this GaN thermal management challenge are metallized diamond heat spreaders. In this paper, a diamond heat spreader has been applied with a hybrid Si micro-cooler for to cool GaN devices. Several different grades and thicknesses of microwave CVD diamond heat spreaders, as well as various bonding layers, are characterized for their thermal effects. The heat spreader is bonded through a TCB (thermal compression bonding) process to a Si thermal test chip designed to mimic the hotspots of 8 GaN units. The heat dissipation capabilities were compared through experimental tests and fluid-solid coupling simulations, both showing consistent results. In one configuration, using a diamond heat spreader 400Ī¼m thick with a thermal conductivity > 2000W/mK, to dissipate 70W heating power, the maximum chip temperature can be reduced by 40.4%, for test chips 100Ī¼m thick. And 10kW/cm2 hotspot heat flux can be dissipated while maintaining the maximum hotspot temperature under 160Ā°C. The concentrated heat flux has been effectively reduced by the diamond heat spreader, and much better cooling capability of the Si micro-cooler has been achieved for high power GaN devices.
Tech Support
Section titled āTech SupportāOriginal Source
Section titled āOriginal SourceāReferences
Section titled āReferencesā- / 2013 - āIntegrating Diamond to Maximize Chip Reliability and Performance,ā
- 2011 - āSi Microchannel Cooler Integrated with High Power Amplifiers for Base Station of Mobile Communication Systemsā
- . 2009 - āA Thermal-Hydraulic Comparison of Liquid Microchannel and Impinging Liquid Jet Array Heat Sinks for High-Power Electronics Cooling,ā [Crossref]
- . 2014 - āA Numerical Study on Comparing the Active and Passive Cooling of AlGaN/GaN HEMTsā
- 2013 - āTrapezoidal Microchannel Heat Sink With Pressure-Driven and Electro-Osmotic Flows for Microelectronic Coolingā
- 2014 - āApplication of the Kirchhoff Transform to Thermal Spreading Problems With Convection Boundary Conditionsā
- . 2008 - āSingle-phase Hybrid Micro-channel/Microjet Impingement Cooling,ā [Crossref]
- 2014 - āSurrogate-Based Analysis and Optimization for the Design of Heat Sinks With Jet Impingementā
- . 2004 - āOptimized Heat Transfer for High Power Electronic Cooling Using Arrays of Microjets,ā [Crossref]