The effects of cutting selected hard - machinable materials with inner diameter diamond saw
At a Glance
Section titled “At a Glance”| Metadata | Details |
|---|---|
| Publication Date | 2015-08-30 |
| Journal | Mechanik |
| Authors | Bożena Ciałkowska, Magdalena Wiśniewska, Iwona Druszcz, Krzysztof Banaszkiewicz |
| Institutions | Wrocław University of Science and Technology |
| Analysis | Full AI Review Included |
Technical Documentation & Analysis: Precision Slicing of Hard Materials using ID Diamond Saws
Section titled “Technical Documentation & Analysis: Precision Slicing of Hard Materials using ID Diamond Saws”This document analyzes the research paper “The effects of cutting selected hard - machinable materials with inner diameter diamond saw” and correlates the findings with 6CCVD’s advanced capabilities in MPCVD diamond material supply and precision processing.
Executive Summary
Section titled “Executive Summary”This research validates the Inner Diameter (ID) diamond sawing technique as a critical method for the high-precision slicing of hard, brittle, non-metallic monocrystalline materials, essential for the electronics, optics, and photovoltaic industries.
- Core Application: Precision slicing of high-value crystalline materials (Silicon, Quartz, Garnet, etc.) to produce thin wafers/plates.
- Key Achievement: Demonstrated successful cutting of materials up to 8.5 Mohs hardness, achieving low surface roughness (Ra as low as 0.16 µm).
- Material Efficiency: The method minimizes material loss, with a measured average kerf width of only 257 µm, crucial for expensive substrates.
- Surface Integrity: Confirmed the formation of a subsurface damage (SSD) layer (15-25 µm for Si), necessitating subsequent ultra-precision polishing.
- 6CCVD Relevance: The requirements for high-quality, low-damage wafers directly align with 6CCVD’s expertise in supplying and processing high-purity Single Crystal Diamond (SCD) and Polycrystalline Diamond (PCD) substrates, which require similar, highly controlled slicing and polishing methods.
Technical Specifications
Section titled “Technical Specifications”The following hard data points were extracted from the analysis of the ID diamond sawing process and resulting surface quality metrics.
| Parameter | Value | Unit | Context |
|---|---|---|---|
| ID Saw Blade Thickness Range | 0.1 - 0.2 | mm | Standard industrial tool specification |
| Peripheral Cutting Speed | 20 | m/s | Constant speed used for all tested materials |
| Average Kerf Width (Material Loss) | 257 | µm | Measured average width of the cut slot |
| Subsurface Damage Layer (Si) | 15 - 25 | µm | Layer requiring removal post-slicing |
| Lowest Surface Roughness (Ra) | 0.16 | µm | Achieved on Quartz crystal (Kryształ górski) |
| Highest Mohs Hardness Tested | 8.5 | - | Yttrium Aluminum Garnet (Granat itrowo - glinowy) |
| Lowest Waviness (Wa) | 2.57 | µm | Achieved on Silicon (Krzem) |
| Highest Waviness (Wa) | 8.68 | µm | Achieved on Quartz crystal (Kryształ górski) |
Key Methodologies
Section titled “Key Methodologies”The experiment focused on optimizing the ID diamond sawing process for various hard, non-metallic monocrystals.
- Material Selection: Five distinct monocrystalline materials were chosen based on varying hardness (Mohs 4 to 8.5) and physicochemical properties: Nephrite, Quartz, Yttrium Aluminum Garnet (YAG), Silicon, and Calcium Fluoride.
- Tooling: Inner Diameter (ID) diamond saws were utilized, characterized by a thin core (0.1-0.2 mm) and a multi-layered, galvanically bonded diamond abrasive edge.
- Workpiece Mounting: Samples were secured to the machine holder using thermoplastic adhesive. This method was critical for protecting the exit edge of the cut from chipping and preventing material loss or damage.
- Process Parameters: Cutting was performed at a constant peripheral speed of 20 m/s, utilizing continuous cooling to manage thermal shock and friction.
- Quality Analysis: Post-cut surfaces were analyzed for quality metrics, specifically measuring surface roughness (Ra) and waviness (Wa), and comparing results across different materials.
6CCVD Solutions & Capabilities
Section titled “6CCVD Solutions & Capabilities”The research highlights the stringent requirements for precision slicing and surface quality in advanced material manufacturing. 6CCVD specializes in providing the highest quality MPCVD diamond materials and processing services necessary to meet or exceed these standards, particularly when handling the ultimate hard material: diamond itself.
Applicable Materials
Section titled “Applicable Materials”To replicate or extend this research into high-performance applications requiring extreme thermal, electrical, or optical properties, 6CCVD recommends:
- Optical Grade Single Crystal Diamond (SCD): Required for applications demanding ultra-low defect density, high thermal conductivity, and superior optical transparency (e.g., high-power optics, quantum computing substrates).
- High Purity Polycrystalline Diamond (PCD): Suitable for large-area thermal management solutions or mechanical components where high hardness and large dimensions (up to 125mm diameter) are critical.
- Boron-Doped Diamond (BDD): Essential for electrochemical applications or high-power electronics where conductive, hard substrates are required.
Customization Potential
Section titled “Customization Potential”The paper emphasizes the need for precise dimensions and minimal post-processing. 6CCVD’s capabilities directly address these needs:
| Research Requirement | 6CCVD Capability | Technical Specification |
|---|---|---|
| Wafer Dimensions | Custom Plates and Wafers | SCD thickness: 0.1 µm - 500 µm. PCD plates up to 125mm diameter. Substrates up to 10mm thick. |
| Surface Damage Removal | Ultra-Precision Polishing | Achieved roughness of Ra < 1 nm (SCD) and Ra < 5 nm (Inch-size PCD), ensuring complete removal of the 15-25 µm subsurface damage layer caused by slicing. |
| Post-Processing Integration | In-House Custom Metalization | We provide integrated deposition of Au, Pt, Pd, Ti, W, and Cu, allowing engineers to receive sliced and metalized wafers ready for device integration. |
| Complex Geometries | Advanced Laser Cutting | While ID sawing is effective, 6CCVD uses high-precision laser cutting for complex shapes and features in diamond, minimizing material waste and achieving tight dimensional tolerances. |
Engineering Support
Section titled “Engineering Support”The challenges outlined in the paper—managing thermal shock, minimizing chipping, and ensuring surface integrity—are magnified when processing diamond. 6CCVD’s in-house PhD team offers specialized consultation on material selection, orientation, and processing techniques for similar High-Precision Slicing and Wafer Preparation projects. We ensure the optimal diamond material is selected and processed to minimize defects and maximize device performance.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
68 MECHANIK NR 8-9