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The structure and electrochemical properties of BDD deposited on the Ti-substrate with Ta buffer layer

MetadataDetails
Publication Date2015-01-01
JournalAdvances in computer science research
AuthorsFeng Liu, Zhengran Huang, Dawei Pan, Guosheng Huang, Yonggui Yan
InstitutionsChina State Shipbuilding (China), Ocean University of China
AnalysisFull AI Review Included

Technical Documentation & Analysis: BDD Electrodes for Advanced Water Treatment

Section titled ā€œTechnical Documentation & Analysis: BDD Electrodes for Advanced Water Treatmentā€

This research demonstrates a high-performance strategy for synthesizing Boron-Doped Diamond (BDD) electrodes on cost-effective Titanium (Ti) substrates for industrial wastewater treatment via electrochemical oxidation.

  • Interface Engineering Success: A nanometer-thick Tantalum (Ta) buffer layer was successfully implemented between the Ti substrate and the BDD film, effectively preventing the formation of detrimental Titanium Carbide (TiC).
  • Stress Mitigation: The Ta buffer layer drastically reduced the internal biaxial compressive stress in the BDD film by 66%, dropping from 1.553 GPa (on Ti) to 0.518 GPa (on Ti/Ta), enhancing film adhesion and stability.
  • High Electrochemical Performance: The resulting BDD electrodes exhibited a wide potential window (~3.2 V) and low background current (<10 µA cm-2), indicative of high film quality and corrosion resistance.
  • Environmental Efficacy: Near 100% Chemical Oxygen Demand (COD) removal efficiency was achieved during the electrochemical oxidation of 2,4-dichlorophenol, confirming the material’s suitability for treating biorefractory pollutants.
  • Synthesis Method: Films were grown using Microwave Plasma Chemical Vapour Deposition (MWCVD), a core capability offered by 6CCVD.
ParameterValueUnitContext
BDD Deposition MethodMWCVDN/ACore growth technique
MWCVD Power1.7KWPlasma input during growth
MWCVD Pressure4.7KPaGrowth environment pressure
Ta Buffer DepositionMagnetron SputteringN/AIntermediate layer technique
Ta Sputtering Power100WPower for Ta film deposition
Ta Sputtering Pressure0.3PaPressure for Ta film deposition
BDD Crystallite Size0.5 - 1.5µmTypical size range of facets
Biaxial Stress (Ti/BDD)1.553GPaHigh residual stress without buffer
Biaxial Stress (Ti/Ta/BDD)0.518GPaStress reduced by Ta buffer
Electrochemical Window~3.2VWide potential range for oxidation
Background Current Density<10µA cm-2Indicates high film integrity and low side reactions
COD Removal Efficiency~100%Oxidation of 2,4-dichlorophenol
Electrode Area Used1cm2Working electrode dimension

The BDD electrodes were synthesized and characterized using the following sequence of steps, focusing on interface control and material verification:

  1. Substrate Preparation: Ti wafers were used as the base substrate material.
  2. Buffer Layer Deposition: A nanometer-thick Tantalum (Ta) film was deposited onto the Ti substrate using magnetron sputtering (100 W power, 0.3 Pa pressure) to serve as a diffusion barrier.
  3. BDD Film Growth: Boron-doped diamond thin films were deposited via Microwave Plasma Chemical Vapour Deposition (MWCVD) at 1.7 KW power and 4.7 KPa pressure.
  4. Structural Analysis: X-ray Diffractometry (XRD) confirmed the presence of diamond (111) and (220) planes, and critically, the elimination of TiC peaks when the Ta buffer was present.
  5. Morphological Analysis: Scanning Electron Microscopy (SEM) confirmed well-faceted polycrystalline crystallites (0.5-1.5 µm size).
  6. Stress Measurement: Raman spectroscopy was used to measure the shift in the diamond peak (1332 cm-1) to calculate the biaxial compressive stress in the BDD film.
  7. Electrochemical Testing: Cyclic voltammetry (CV) was performed in 1 molL-1 H2SO4 solution at room temperature, demonstrating the wide potential window and low background current.
  8. Performance Validation: Potentiostatic oxidation was used to measure the decay of Chemical Oxygen Demand (COD) during the degradation of 2,4-dichlorophenol.

6CCVD is uniquely positioned to supply the advanced BDD materials and custom fabrication required to replicate, scale, and extend this high-performance electrochemical research.

To achieve the high conductivity and stability required for efficient electrochemical oxidation, 6CCVD recommends the following materials:

Material Specification6CCVD CapabilityRelevance to Research
Heavy Boron-Doped PCDPolycrystalline Diamond (PCD) with high boron concentration for metallic conductivity.Directly matches the BDD film requirement for high current density anodes.
Thin Film BDDCustom thickness control from 0.1 µm up to 500 µm.Allows precise replication of the thin film architecture necessary for electrode applications.
High-Purity SCD (Reference)Single Crystal Diamond (SCD) for unstressed reference material (1332 cm-1).Essential for accurate calibration and stress calculation via Raman spectroscopy.

The success of this research hinges on precise interface engineering and custom substrate handling, areas where 6CCVD excels.

  • Custom Substrate Integration: 6CCVD can handle non-standard substrates, including Titanium (Ti), for direct BDD deposition, enabling seamless integration of the BDD film onto the final device architecture.
  • Buffer Layer Metalization: The paper utilized a Ta buffer layer. 6CCVD offers extensive internal metalization capabilities including Ti, W, Cu, Au, Pt, and Pd. We can collaborate to integrate Ta or alternative adhesion/barrier layers (e.g., Ti/W) via sputtering or evaporation prior to MWCVD growth.
  • Dimension Scaling: While the paper used 1 cm2 electrodes, 6CCVD can supply PCD plates/wafers up to 125 mm in diameter, enabling industrial scaling of this wastewater treatment technology.
  • Precision Fabrication: We offer laser cutting and shaping services to produce custom electrode geometries (e.g., 1 cm2 squares, rods, or complex shapes) with high precision.
  • Surface Finish: We provide advanced polishing services for PCD (Ra < 5 nm) to ensure optimal surface smoothness and electrochemical uniformity, potentially improving current distribution and lifetime.

The 6CCVD in-house PhD team specializes in optimizing diamond growth recipes and material selection for demanding applications.

  • Electrochemical Anode Design: We provide consultation on optimizing boron doping levels and film thickness to maximize the potential window and minimize residual stress for similar electrochemical oxidation projects.
  • Stress Mitigation Strategies: Our experts can assist researchers in developing alternative buffer layers or growth parameters to further reduce the residual stress below the 0.518 GPa achieved in this study, thereby extending electrode lifespan.
  • Global Logistics: We ensure reliable global shipping (DDU default, DDP available) for sensitive materials, supporting international research and development efforts.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

In this paper, boron doped diamond (BDD) thin flms have been deposited on Ti-based substrates with or without a Ta intermediate layer by microwave plasma chemical vapour deposition (MWCVD).Raman spectroscopy and scanning electron microscopy (SEM) examinations demonstrate that the electrode has well-defined diamond features.XRD spectroscopy shows no TiC in the BDD film on the Ti substrate with Ta buffer layer.It is observed that both the BDD electrodes have similar overpotential 2.5V for water electrolysis prohibiting the evolution of oxygen in the cyclic voltammetry test.Further more,the removal efficiency of chemical oxygen demand (COD) approaches to 100% in the electrochemical oxidation of wastewater containing phenol.