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Generation of Ensembles of Individually Resolvable Nitrogen Vacancies Using Nanometer-Scale Apertures in Ultrahigh-Aspect Ratio Planar Implantation Masks

MetadataDetails
Publication Date2015-01-26
JournalNano Letters
AuthorsIgal Bayn, Edward H. Chen, Matthew E. Trusheim, Luozhou Li, Tim Schröder
InstitutionsBrookhaven National Laboratory, Massachusetts Institute of Technology
Citations47
AnalysisFull AI Review Included

Generation of High-Density Qubit Ensembles via Nanoscale Mask Implantation

Section titled “Generation of High-Density Qubit Ensembles via Nanoscale Mask Implantation”

The analyzed research details a breakthrough methodology for the targeted, high-throughput fabrication of Nitrogen Vacancy (NV) center ensembles in diamond, achieving state-of-the-art spatial localization crucial for quantum information applications.

  • Ultra-Precision Qubit Placement: Demonstrated spatial localization of NV ensembles with a full-width half-maximum (FWHM) down to 26 ± 2.4 nm, a result limited by the fundamental ion implantation straggle, not the mask aperture dimensions.
  • Nanoscale Aperture Control: Achieved unprecedented sub-1 nm critical dimension control in implantation masks (minimum gap width of 0.9 ± 0.3 nm) using a novel combination of Electron Beam Lithography (EBL), Reactive Ion Etching (RIE), and conformal Alumina (Al₂O₃) Atomic Layer Deposition (ALD).
  • Ultrahigh-Aspect Ratio Masks: Utilized 270 nm thick silicon masks to ensure high isolation and prevent unwanted implantation scattering, a key challenge previously limiting high-resolution techniques.
  • Dipolar Coupling Advancement: Successfully resolved NV-NV separations as close as 16 ± 5 nm, enabling the fast dipolar coupling necessary for forming coupled spin systems and robust quantum registers.
  • Scalability and Throughput: The approach supports arbitrarily large (mm-scale) mask transfer and simultaneous nitrogen implantation into millions of target regions (up to 3x10⁔ lines), positioning it for scalable fabrication of quantum devices.
  • Material Foundation: Research relies exclusively on ultra-high purity Single Crystal Diamond (SCD) substrates (Nitrogen concentration < 5 ppb).

ParameterValueUnitContext
Diamond Substrate Purity (N)< 5 to < 10ppbUltra-pure Single Crystal Diamond (SCD)
Implantation Mask Thickness270nmSilicon-on-Insulator (SOI) based hard mask
Minimal Aperture Width (Wmin)0.9 ± 0.3nmAchieved via Al₂O₃ ALD shrinkage
Implantation Energy (Sample A)6keVOptimized for minimum lateral straggle
Implantation Energy (Sample B)20keVUsed when Al₂O₃ layer was deposited after mask transfer
Implantation Dose (Sample A)2 x 1013ions/cm215N ions
Annealing Temperature850°CVacuum environment for NV formation
Theoretical Lateral Straggle (6 keV)3.1nmSRIM Simulation limit (Sample A)
Measured NV Ensemble Localization (FWHM)26 ± 2.4nmIn the confined direction (DNV(meas))
Resolved NV-NV Separation16 ± 5nmClosest pair in a 3-NV ensemble
Isolation Factor Requirement100N/ALower limit for background reduction (requires ~75 nm PMMA for 10 nm depth)

The experiment successfully employed complex nanofabrication techniques to create ultrahigh-aspect ratio hard masks, transferring precision features down to the sub-nanometer scale onto the diamond substrate.

  1. Mask Substrate Definition: Used 270 nm thick Silicon-on-Insulator (SOI) wafers with a 3 ”m buried SiO₂ layer for hard mask fabrication.
  2. Patterning: EBL (JEOL JBX-6300FS, 100 kV, 600 ”C/cm2 dose) was used to define high-resolution line patterns in ZEP 520A resist.
  3. Pattern Transfer (RIE): Cryogenic Reactive Ion Etching (RIE) using SF₆:O₂ plasma (800 W ICP, 15 W RF) transferred the pattern into the 270 nm thick Si membrane, employing intentional over-etching to achieve high aspect ratios.
  4. Aperture Narrowing via ALD: Conformal Atomic Layer Deposition (ALD) of Alumina (Al₂O₃) was used to shrink the initial EBL-defined features (e.g., 45 nm lines) down to sub-1 nm dimensions (0.9 ± 0.3 nm).
  5. Mask Release and Transfer: The SOI masks were undercut in 49% concentrated Hydrofluoric acid (HF). Large-area (mm-scale) masks were mechanically transferred onto ultra-pure SCD substrates.
  6. Ion Implantation: Samples were implanted with 15N ions at two energies (6 keV and 20 keV) to control the implantation depth (~9.2 - 9.6 nm).
  7. NV Center Formation: Post-implantation, the masks were removed, and the diamond substrates were annealed in vacuum at 850°C to mobilize the vacancies and form the stable NV- color centers.
  8. Characterization: NV localization was verified using super-resolution imaging techniques, including wide-field Deterministic Emitter Switch Microscopy (DESM), demonstrating spatial resolution down to 8 ± 3 nm.

6CCVD provides the foundational single crystal diamond materials and advanced customization services required to replicate this groundbreaking research and push the limits of NV ensemble fabrication for high-coherence quantum systems.

The success of this work is fundamentally dependent on ultra-high purity material (< 5 ppb N concentration) to ensure long spin coherence times and minimal background noise.

6CCVD Material RecommendationMaterial SpecificationTechnical Relevance to Research
Optical Grade Single Crystal Diamond (SCD)Guaranteed Nitrogen Concentration < 5 ppb (or better upon request).Directly meets the required purity to minimize background defects and magnetic noise, essential for milliseconds-long coherence times (T₂) cited in the paper.
Ultra-Smooth SCD WafersPolishing achieving Ra < 1 nm (guaranteed specification).Provides a superior starting surface, mitigating the risk of strain-induced poor ODMR contrast observed in mechanically polished samples, optimizing the substrate for shallow implantation.
Custom PCD PlatesAvailable up to 125 mm diameter/side length.While the paper used SCD, our large-format Polycrystalline Diamond (PCD) substrates offer a pathway for highly scalable industrial production of certain diamond devices where optical grade is less critical.
Boron-Doped Diamond (BDD)Custom BDD films for integration layers or electrodes.Relevant for spintronic devices and quantum control systems requiring conductive diamond surfaces (as referenced in the paper’s application list).

The experimental setup relied on highly specialized masks and preparation steps that 6CCVD is uniquely equipped to support for external researchers.

  • Custom Dimensions: 6CCVD can supply SCD wafers and plates in custom dimensions and thicknesses (SCD from 0.1 ”m up to 500 ”m, substrates up to 10 mm) to perfectly match unique implantation mask geometries (e.g., mm-scale mask transfer for high-throughput Sample B).
  • Nanoscale Metalization Services: The research utilized Platinum (Pt) deposition for Focused Ion Beam (FIB) sectioning during mask analysis. 6CCVD provides internal, high-precision metalization capabilities, including:
    • Au, Pt, Pd, Ti, W, Cu thin film deposition.
    • This is critical for fabricating contact pads, complex hard mask layers, or stabilizing layers needed in advanced nanodevice processing.
  • Precision Laser Cutting & Machining: We offer laser cutting services for custom substrate shapes and precise alignment features, enabling efficient mechanical transfer of patterned membranes onto the diamond.

6CCVD’s in-house PhD team specializes in MPCVD growth parameters, defect engineering, and material processing for quantum applications.

  • Our experts can assist researchers in selecting the optimal diamond purity and orientation (e.g., < 5 ppb N, {100} or {111}) necessary to replicate or extend this methodology, especially concerning the tradeoff between ion straggle (requiring low keV implantation) and achieving high NV conversion yield.
  • We offer consultation on post-growth processes, including specialized surface treatments and annealing protocols (like the required 850°C vacuum anneal) to maximize the successful creation of isolated, coupled NV centers for quantum information processing and quantum register projects.

For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.

View Original Abstract

A central challenge in developing magnetically coupled quantum registers in diamond is the fabrication of nitrogen vacancy (NV) centers with localization below ∌20 nm to enable fast dipolar interaction compared to the NV decoherence rate. Here, we demonstrate the targeted, high throughput formation of NV centers using masks with a thickness of 270 nm and feature sizes down to ∌1 nm. Super-resolution imaging resolves NVs with a full-width maximum distribution of 26 ± 7 nm and a distribution of NV-NV separations of 16 ± 5 nm.

  1. 2001 - Optical Properties of Diamond: A Data Handbook [Crossref]