Coating Technology of High-Performance DLC Films and Industrial Application
At a Glance
Section titled âAt a Glanceâ| Metadata | Details |
|---|---|
| Publication Date | 2015-01-01 |
| Journal | Journal of the Vacuum Society of Japan |
| Authors | Masanori Hiratsuka, Akihiro Tanaka |
| Institutions | JTEC Corporation (Japan) |
| Citations | 2 |
| Analysis | Full AI Review Included |
Technical Documentation & Analysis: High-Performance Carbon Films (ICF/DLC)
Section titled âTechnical Documentation & Analysis: High-Performance Carbon Films (ICF/DLC)âExecutive Summary
Section titled âExecutive SummaryâThis research highlights the development and application of functionalized carbon films, termed Intrinsic Carbon Film (ICF) and Diamond-Like Carbon (DLC), achieved through advanced deposition techniques like Ionized Evaporation and High Power Impulse Magnetron Sputtering (HiPIMS).
- Functionalization via Doping: ICF films were engineered using elemental doping (e.g., F, Si, Ti, MoS2) and structural control to impart specific properties, including electrical conductivity, hydrophobicity, and enhanced tribological performance.
- Extreme Environment Performance: Specialized ICF demonstrated ultra-low friction coefficients (as low as 0.04) in high vacuum (10-2 Pa) and maintained stability and low friction (0.1) at high temperatures (500°C).
- High Hardness & Density: HiPIMS technology enabled the fabrication of high-density (up to 2.6 g/cm3) hydrogen-free ICF with exceptional hardness (30 GPa), significantly exceeding conventional magnetron sputtering results.
- Electrochemical Applications: Conductive ICF films, exhibiting hardness > 10 GPa and resistivity as low as 10-2 Ωcm, were successfully evaluated as protective counter electrodes for dye-sensitized solar cells (DSSC).
- Advanced Manufacturing: The HiPIMS method achieved high deposition rates (up to 660 nm/min) and low processing temperatures (< 100°C), enabling large-scale, cost-effective coating on temperature-sensitive substrates like plastics (Roll-to-Roll coating).
- 6CCVD Value Proposition: While this research focuses on amorphous carbon (DLC/ICF), 6CCVDâs Single Crystal (SCD) and Polycrystalline Diamond (PCD) offer the ultimate material solution, providing intrinsic hardness (90-100 GPa), superior thermal management, and stable, high conductivity (BDD) for next-generation devices.
Technical Specifications
Section titled âTechnical Specificationsâ| Parameter | Value | Unit | Context |
|---|---|---|---|
| Conductive ICF Hardness | > 10 | GPa | Nanoindentation |
| Conductive ICF Resistivity Range | 10-2 to 1 | Ωcm | Four-probe method |
| Vacuum Tribology Friction Coefficient | 0.04 | N/A | ICF at 10-2 Pa vacuum |
| Vacuum Tribology Hardness | 13 | GPa | ICF optimized for vacuum applications |
| Heat Resistant ICF Hardness | 15 | GPa | Maintained at 500°C |
| Heat Resistant ICF Friction Coefficient | 0.1 | N/A | Maintained at 500°C |
| Hydrophobic Contact Angle (Max) | 90.5 | ° | F-doped ICF (33.73 atomic% F) |
| HiPIMS Hydrogen-Free ICF Hardness | 30 | GPa | Nanoindentation |
| HiPIMS Hydrogen-Free ICF Density | 1.8 - 2.6 | g/cm3 | X-ray reflectivity |
| HiPIMS Max Deposition Rate | 660 | nm/min | Optimized high power pulse conditions |
| HiPIMS Processing Temperature | < 100 | °C | Low-temperature deposition capability |
Key Methodologies
Section titled âKey MethodologiesâThe functional ICF films were developed using highly controlled physical vapor deposition (PVD) and plasma-based techniques, focusing on precise structural and elemental control.
- Ionized Evaporation (IE) / Plasma Chemical Vapor Deposition (PCVD): Used as the foundational methods for depositing DLC and ICF films, utilizing both solid graphite targets and hydrocarbon gases (e.g., acetylene).
- Elemental Doping: Foreign elements (Si, Ti, O, F, MoS2) were introduced during deposition to modify film properties. Fluorine (F) doping via hydrocarbon gas was used to achieve high hydrophobicity (contact angle up to 90.5°).
- High Power Impulse Magnetron Sputtering (HiPIMS): Employed a specialized pulse power supply capable of 100 kW instantaneous output, generating ultra-high density plasma (1011-1012 cm-3). This technique was critical for achieving high density (up to 2.6 g/cm3), high hardness (30 GPa), and high deposition rates (660 nm/min).
- Structural Control: The ratio of sp3 (diamond-like) and sp2 (graphite-like) bonding was manipulated to control electrical conductivity (increasing sp2 content or doping) while maintaining high mechanical strength.
- Substrate Preparation: For vacuum tribology applications, micro-grooves were laser-machined onto stainless steel substrates prior to DLC deposition to enhance long-term low-friction performance in vacuum environments (10-4 Pa).
6CCVD Solutions & Capabilities
Section titled â6CCVD Solutions & Capabilitiesâ6CCVD provides MPCVD diamond materials that offer superior intrinsic properties compared to the amorphous carbon films (ICF/DLC) discussed in this research, enabling engineers to achieve higher performance benchmarks in tribology, electrochemistry, and thermal management.
| Research Requirement/Application | 6CCVD Material Solution | 6CCVD Capability Alignment |
|---|---|---|
| Extreme Hardness & Wear Resistance (ICF Hardness up to 30 GPa) | Optical Grade Single Crystal Diamond (SCD) | SCD offers intrinsic hardness (90-100 GPa), far exceeding the ICF benchmark, ensuring maximum durability for high-load tooling, cutting edges, and extreme tribological components. |
| High Electrical Conductivity (DSSC Counter Electrodes, Sensors) | Heavy Boron-Doped Diamond (BDD) | BDD provides stable, metallic-like conductivity with unparalleled electrochemical stability, making it the ideal choice for high-performance electrodes, sensors, and electrochemical reactors, surpassing the performance of doped amorphous carbon. |
| High Thermal Management (Heat Resistant ICF up to 500°C) | High Purity Polycrystalline Diamond (PCD) | PCD offers the highest known thermal conductivity (up to 2000 W/mK), ensuring superior heat dissipation for high-power electronic components, far exceeding the thermal capabilities of ICF. |
| Custom Dimensions & Large Area (Roll-to-Roll, large components) | PCD Wafers up to 125mm | 6CCVD manufactures PCD plates and wafers up to 125mm in diameter, offering custom thicknesses (0.1”m - 500”m) and substrate options (up to 10mm thick) for large-scale scientific and industrial applications. |
| Advanced Device Integration (Ti/Pt/Au electrodes, Fig. 5 setup) | Custom Metalization Services | We offer in-house deposition of critical metals including Au, Pt, Pd, Ti, W, and Cu. This capability allows researchers to receive fully integrated diamond components ready for bonding, sensing, or electrochemical testing. |
| Ultra-Smooth Surfaces (Optical, Biological, Low-Friction) | Precision Polishing (Ra < 1 nm) | SCD films are polished to an atomic-level smoothness (Ra < 1 nm), and inch-size PCD can achieve Ra < 5 nm, crucial for minimizing friction in vacuum environments and optimizing surface energy for biological compatibility (e.g., stents, artificial joints). |
6CCVD specializes in providing materials that meet or exceed the performance requirements outlined in this research. Our in-house PhD team can assist with material selection for similar tribological, electrochemical, and high-temperature projects, ensuring optimal diamond specifications (SCD, PCD, or BDD) are chosen for your specific application.
For custom specifications or material consultation, visit 6ccvd.com or contact our engineering team directly.
View Original Abstract
Diamond-like carbon (DLC) films have attractive properties such as low friction, anti-wear, high hardness, and anti-corrosion. Such DLC films have been fabricated with various deposition methods such as magnetron sputtering, ion plating, filtered arc deposition, and plasma-enhanced chemical vapor deposition. The properties such as low friction in vacuum, electrical conductivity, hydrophobicity, and heat resistance can be added to DLC films by the modification of conventional deposition methods, or the doping of foreign elements. These DLC films can be applied to tribological parts in vacuum environment, dies for plastic moldings, inspection components of semiconductors, components of solar cells, and devices of medical engineering. Modified deposition techniques can also fabricate DLC films to large-scale machine components.